Principal - Signal Integrity Engineer

Region: Americas, USA (New Hampshire) – Remote

About the role

Celestica Engineering is seeking a highly motivated and self-driven Signal Integrity Engineer to help design and build market-leading hardware platform solutions. The Signal Integrity Engineer will serve as the subject matter expert in planning digital PCB designs, simulation, lab verification, and troubleshooting signal integrity issues on completed designs. They will also assist with design reviews of critical PCBs for signal integrity concerns. Strong communication skills and the ability to work with physically dispersed teams are required.

Responsibilities

• Define and develop next-generation technologies for networking, server, and storage products.
• Provide innovative solutions to complex and sensitive problems requiring ingenuity and creativity.
• Serve as a technical consultant and leader for the team.
• Engage with customers and suppliers on product roadmaps and support.
• Communicate progress toward project and program goals.
• Lead, motivate, and direct a workgroup.
• Perform signal integrity simulations and lab verification for digital PCB designs.
• Troubleshoot signal integrity issues on completed designs.
• Review critical PCBs for signal integrity concerns.
• Develop test fixtures for measurements, including custom test boards and ad-hoc probing solutions.
• Make cost vs. performance tradeoffs in signal path design.

Requirements

• 12+ years of experience with high-speed signal delivery design and evaluation, including signal integrity within a PCB and off-board (board-to-board connectors, ribbon cables, coaxial cable, etc.).
• Bachelor’s degree in Electrical Engineering (Master’s preferred).
• Proficiency in PCB design fundamentals (single-ended and differential signals).
• Experience with signal loss, impedance control, and crosstalk (near-end and far-end).
• Experience with single-ended and differential signaling up to 50Gbps.
• Experience working with component models (Touchstone files) and cascading models to generate complete system simulations.
• Simulation of digital interfaces (FPGA to DRAM, SERDES interfaces) and analog paths through PCB, connector, and cable.
• Proficiency with 2D and 3D simulation tools (e.g., ADS, ANSYS HFSS, Sigrity).
• Electrical length calculations for signal matching.
• Familiarity with interpreting signals in both frequency (S-parameter) and time domains, including generating and interpreting data-eye diagrams up to 50Gbps (NRZ and PAM4).
• Proficiency with Allegro or similar layout tools and schematics.
• Experience with PCB stack-up design, fabrication limitations, and cost trade-offs.
• High-frequency board material experience.
• Significant experience with lab measurements: TDR and VNA measurements.
• Experience with flex circuit design for high-speed signaling.
• Strong organizational, cross-functional, and customer-focused skills.