Jobs · Engineering · California

Principal, Printed Circuits Boards Manufacturing Engineer

d-Matrix · Santa Clara, CA · 1 mo ago
HybridEngineeringFull-time

Role Overview

d-Matrix is looking for a principal PCB manufacturing engineer to own the fabrication technology and supplier ecosystem behind our current and next-generation AI hardware. This role carries deep subject-matter expertise in PCB manufacturing and design principles and is responsible for developing and deploying advanced PCB fabrication capabilities that hit world-class marks for time-to-market, cost, quality, and delivery. You will drive DFM strategy, qualify and audit global fabrication suppliers, define reliability standards, and evaluate emerging materials and stackup technologies. You will partner closely with CAD, signal/power integrity, and sourcing teams to catch manufacturing risk early and build a resilient, second-sourced supply chain. This is a high-impact, cross-functional role for someone who wants to shape how d-Matrix's boards get built at scale.

What You Will Do

  • Perform PCB DFM/DFA assessments on current and next-generation designs to identify and mitigate yield and cost risk.
  • Establish and enforce company-wide PCB design guidelines.
  • Audit and qualify global PCB fabrication partners.
  • Drive supplier process controls, 8D corrective actions, and continuous yield and cost improvements.
  • Define IPC-compliant reliability standards, including CAF, IST, and microvia reliability testing.
  • Monitor vendor SPC metrics against those standards.
  • Evaluate advanced PCB materials, high-layer-count stackups, HDI/microvias, and signal/power integrity and thermal management requirements.
  • Engage early ("left-shift") with CAD, SI/PI, and sourcing teams to de-risk production and support second-sourcing strategies.

What You Will Bring

  • Master's degree in electrical, materials, mechanical, or manufacturing engineering, or a related field.
  • 10+ years of experience in PCB design, fabrication, or supplier quality for high-performance computing, AI hardware, networking, or semiconductors.
  • Deep knowledge of high-layer-count (HLC) boards, HDI, microvias, sequential lamination, and ultra-low-loss laminates.
  • Fluency in IPC standards: IPC-6012, IPC-A-600, IPC-2221/2222, IPC-TM-650, IPC-4101.
  • Expertise in SPC, DFMEA/PFMEA, 8D root-cause analysis, IST, and CAF testing.

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