Principal Power and Board Design Engineer

Key Responsibilities

• Develop and optimize power conversion circuits, including DC-DC converters, voltage regulators, and power modules.
• Design and optimize power delivery for ASICs, ensuring stable voltage and current distribution across the board.
• Address power integrity challenges such as voltage ripple, noise, and impedance mismatches.
• Develop and implement board-level designs, to meet electrical and mechanical requirements with a deep understanding of PCB layout rules and constraints.
• Implement thermal solutions to maintain optimal operating temperatures for components.
• Evaluate and select appropriate power components, such as voltage regulators, capacitors, and inductors, ensuring they meet performance, thermal, and reliability specifications.
• Work closely with component vendors to identify and source the best power solutions, ensuring compatibility with our ASIC designs and meeting quality standards.
• Work closely with cross-functional teams, including firmware, mechanical, and validation engineers, to integrate designs into complete systems.
• Generate and maintain comprehensive design documentation, including Specifications, schematics and BOMs.
• Conduct thorough debugging and analysis of power-related or system level issue utilizing lab equipment such as oscilloscopes and power analyzers to identify and resolve problems.

Qualifications

• Education: Bachelor’s or Master’s degree in electrical engineering or a related field.
• Experience: 8-10 years of experience in power and board design engineering, with a focus on ASIC or high-speed digital designs.
• Technical Skills: Proficiency in Cadence OrCAD and Allegro for schematic capture and PCB layout. Strong understanding of power integrity principles and techniques. Experience with power component selection and vendor collaboration. Hands-on experience with debugging power-related issues using lab equipment.
• Soft Skills: Excellent problem-solving and analytical skills. Strong communication and teamwork abilities. Ability to work in a fast-paced, collaborative environment.

Preferred Qualifications

• Experience with high-speed interfaces such as PCIe, DDR, and USB.
• Familiarity with electromagnetic interference (EMI) and electromagnetic compatibility (EMC) considerations.
• Familiarity with Design for Manufacturability (DFM) considerations.
• Experience in thermal management and reliability analysis.