Principal Mechanical Engineer - Antenna & Electronic Packaging

Date Posted: 2026-07-17 | Location: El Segundo, CA | Onsite

U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance. The ability to obtain and maintain an active, existing DoD Secret security clearance is required after day one.

About the Role

The Airborne Radar Design department is seeking a Principal Mechanical Engineer for the Radar Antenna Design II section. The role involves electronics packaging design for Airborne Radar Subsystems, including Antenna, Receiver, Exciter, Processor, and Power Supply subsystems. Responsibilities span the hardware life cycle, from concept development to production support and installation.

Typical technologies include electronic enclosures, heat exchangers (including coldwalls), machined components, RF microwave assemblies, wiring, connectors, and power supplies. Constraints include size, weight, power, design-to-cost, design for manufacture, and compressed project schedules.

Responsibilities

• Provide technical support on major programs and interface with Lead Mechanical Engineers and Chief Engineers to support design objectives.
• Lead smaller project teams through design development, ensuring adherence to established procedures and creation of technical data packages while meeting program design objectives.
• Develop unit design concepts and perform design trades based on requirements.
• Resolve a wide range of complex technical problems with innovative solutions.
• Create detailed layouts and design documentation using Computer Aided Design (CAD) tools.
• Support suppliers fabricating components and assemblies.
• Understand and work within the Engineering Change Release process and the company’s Product Data Management (PDM) system.
• Serve as a Responsible Engineering Authority (REA) for a subsystem on program assignments.

Requirements

• Bachelor’s degree in Science, Technology, Engineering, or Mathematics (STEM) or a minimum of 7 years’ prior relevant experience.
• Experience with ANSI drawing standards.
• Experience with GD&T (Geometric Dimensioning & Tolerances).
• Experience with electronic packaging for Airborne applications.

Preferred Qualifications

• Design experience in high-frequency environments, enclosure design, EMI shielding, and thermal management.
• High proficiency with CREO or similar 3D solid modeling software.
• Proficiency in RF principles, RF circuit card design, RF materials, manufacturing, and producibility.
• Experience with Antenna, Receiver, Exciter, or Processor mechanical design.
• Exposure to manufacturing processes for CCAs, metal housings, and brazements, or experience in a manufacturing and assembly support role.
• Advanced degree in Mechanical or Aerospace Engineering.
• Prior experience in Defense or Aerospace.
• Active security clearance.

Pay

The salary range for this role is $118,300 – $224,900 USD. The range is representative of all experience levels. Factors considered include role, function, responsibilities, work experience, location, education/training, and key skills.

Benefits

• Medical, dental, and vision insurance.
• Life insurance, short-term disability, and long-term disability coverage.
• 401(k) match.
• Flexible spending accounts.
• Flexible work schedules.
• Employee assistance program.
• Employee Scholar Program.
• Parental leave.
• Paid time off and holidays.
• Eligibility for annual short-term and/or long-term incentive compensation programs (dependent on role level and collective-bargaining agreements).