Principal Engineer, Package Design

Job Summary

The Principal Semiconductor Package Engineer is responsible for the specification, design, development, and qualification of unique custom packaging technology for SiTime’s revolutionary MEMS-based timing products.

Responsibilities

• Develop new packaging technology for SiTime’s MEMS-based timing solutions
• Lead activities for package design, development, and release-to-production
• Develop, manage, and analyze DoEs running locally and overseas
• Manage development activities at OSATs
• Work with OSATs to prototype and test new custom package designs
• Ensure new technologies achieve required performance, reliability, and quality requirements
• Lead troubleshooting activities related to package design or performance

Qualifications & Requirements

• M.S or PhD. Degree in Mechanical Engineering, Material Science, or other relevant field
• 10+ years’ experience in semiconductor IC packaging technology and methodology
• Experience managing overseas OSATs to bring products into production
• Knowledge of leadframe-based, flip-chip, and substrate-based packages
• Experience with flip-chip and bumping technologies
• Understanding of thermal, stress, and electrical considerations in package design
• Hands-on experience with CAD software (AutoCAD preferred but not required)
• The desire to work in a fast-paced, challenging, and risk-taking environment

Desired Characteristics & Attributes

• Understanding of thermal, mechanical, and electrical modeling for semiconductor packages
• Understanding of material characterization techniques (DMA, TMA, TGA, etc.)

Pay & Benefits

Compensation Range: $164,800 - $226,600 annually
Benefits: 401k plan, health and wellness benefits, time off plans, legal services, parental leave, and more.