Principal Engineer

Responsibilities

• Perform semiconductor engineering design, development, and testing for firm products and devices in conjunction with product development for the electronic communications industry.
• Work on a wide range of SoCs spanning different process technologies and market segments to produce a best-in-class combination of power, performance, and thermal behavior.
• Handle device to architecture level optimizations as well as hardware/software co-design.
• Design a wide range of SoC solutions from very cost-sensitive, low power devices to highly integrated, high-performance devices with a worldwide network of design centers.
• Research, design, and develop forward-looking methodologies, novel infrastructures, and architectures for system resource control and holistic energy management.
• Identify new techniques in areas for energy reduction for CPU/GPU/Camera/DDR/ML accelerators both at core and SoC level.
• Experiment with new EDA tools and provide necessary automation to simplify system tradeoff analysis.
• Collaborate with performance, thermal, and system teams in system-level analysis of workloads and use-cases to identify opportunities for energy optimization.
• Participate in efforts to develop and prototype new system solutions and approaches.

Requirements

Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, foreign equivalent, or related field. Five (5) years of experience in the job offered, Staff Design Engineer, or related occupation.

Skills

Position requires five (5) years of experience in:

• Understanding of Models (NLDM, AOCV, CCS, ECSM, LVF).
• Cadence IC Design Suite, Innovus, Synopsys PrimeTime.
• TCL, Perl.
• Timing and test chip blocks, Physical Design.
• Synthesis, Physical Verification, Place and route, and Floorplan.

Pay

$187,272 per year