Power Integrity Engineer

Responsibilities

• Develop creative signal integrity (SI) and power integrity (PI) solutions for complex system design challenges
• Analyze and guide high-speed PCB, BGA, and advanced package designs from 28+ Gbps through the latest signaling technologies
• Run system-level SI simulations for high-speed SERDES links, and model, optimize, and validate vias, connectors, sockets, breakouts, stackups, routing, and package interfaces using 3D EM and circuit simulation tools
• Drive substrate and board-layout SI guidelines, post-layout extraction and analysis, and ongoing improvement of models and methodologies against lab measurements
• Analyze and guide power delivery for ASICs drawing 500+ amps, including static/DC and dynamic/AC analysis across the full power train — PSUs, cables, connectors, voltage regulators, PCBs, capacitor networks, packages, and dies
• Automate simulation, data gathering, analysis, and visualization workflows
• Partner with external design and layout vendors on requirements, deliverables, and tradeoffs, and collaborate with internal electrical, mechanical, package, layout, manufacturing, and validation teams throughout the lifecycle

Qualifications

• MS or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field, or equivalent practical experience
• Experience in signal integrity, power integrity, or both for high-performance electronic systems
• Strong fundamentals in electromagnetics, transmission lines, and PCB/package design
• Experience with high-speed SERDES links, including at least 28+ Gbps signaling; PAM4 at 56/112+ Gbps is preferred
• Experience with high-current (>500 amp) ASIC power supply design
• Proficiency with SI/PI CAE and circuit-simulation tools
• Experience with relevant SI/PI tools such as HFSS, SIwave, Clarity 3D, Sigrity, ADS, SPICE, SIMPLIS, or MATLAB
• Python programming or scripting automation experience for analysis, validation, or debugging
• Ability to translate analysis results into robust, manufacturable PCB and package designs
• Strong collaboration and communication skills, including experience working with external design partners
• Experience with 2.5D packages, board/package layout, or PDN evaluation is preferred
• Familiarity with lab measurement equipment, including VNAs, TDRs, and high-speed oscilloscopes is preferred

Pay

The estimated base salary range for this position is $200,000 to $300,000 USD per year (or local equivalent).