Physics AI - Thermal-Mechanical Reliability
Requirements
Education: PhD in Mechanical Engineering, Materials Science, Physics, or a related field with a deep specialization in computational multi-physics.
Subject Matter Authority: Recognized expertise in 3D-IC reliability, with a profound understanding of the mechanics of warpage, interfacial delamination, and thermal-mechanical coupling in heterogeneous integration.
AI/Simulation Fluent: A strong perspective on the role of GPU acceleration and Machine Learning in scientific computing.
Industry Track Record: 10+ years of experience in the semiconductor or microelectronics industry, having led technical projects that directly impacted product reliability or time-to-market.
Responsibilities
Strategic Leadership: Own the technical roadmap for the thermal-mechanical domain. Define how our Physics AI accelerates traditional FEA/multi-physics workflows to provide real-time reliability insights.
Architectural Innovation: Design end-to-end simulation workflows that address complex 3D-IC challenges, including through-silicon via (TSV) stress, micro-bump reliability, and global package warpage.
High-Stakes Collaboration: Act as the lead technical partner for world-class semiconductor companies, demonstrating how Flexcompute’s speed transforms their iterative design cycles from days to minutes.
Product Influence: Directly influence the development of our GPU-accelerated solvers, ensuring they are optimized for the non-linear material behaviors and multi-scale meshes required for advanced packaging.
Team Building: Recruit, mentor, and lead a high-performing team of engineers specialized in computational mechanics and AI-driven physics.
Benefits
- Competitive compensation with equity of a fast-growing startup.
- Medical, dental, and vision health insurance.
- 401(k) Contribution.
- Gym allowance.
- Friendly, thoughtful, and intelligent coworkers.