Physical Design Engineer

About the role

As a member of our tight knit physical design team, you will be working on the design and analysis of 3D integrated products. This role involves a combination of traditional ASIC/SoC physical design skills, packaging, power, clock and cooling analysis. You will work closely with the architecture and RTL team to do R&D on novel concepts for 3D integration.

Skills And Qualifications Required

• 10+ years of physical design/verification experience.
• Strong knowledge of block level and full-chip physical verification methodology.
• Expert at optimizing for the best power/performance and area.
• Experience with the complete physical design flow.
• Knowledge of Synopsys tool suite is a plus.
• Expert with ICV or Calibre tools resolving block and full-chip DRC and LVS issues.
• Expert with IR/EM analysis and resolution.
• Strong ability in scripting languages like Tcl and Python.
• Ability to make flow enhancements.
• Demonstrated ability to work with RTL teams to optimize for physical design.
• Knowledge of 2.5D or 3D packaging solutions.
• Must have experience with 3d physical design, 3d die stacking, 3d chip design, die-to-die or wafer-to-wafer.
• PREFERRED: Experience doing full chip floor planning and integration.
• Knowledge of clock distribution.
• Knowledge of cooling analysis.

Pay

The salary range for this position is $230,000 – $280,000 annually. Actual compensation will be determined based on factors such as experience, skills, qualifications, and location.