Photonics Nanofabrication Process Engineer

Job Description

The group seeks a highly motivated, detail-oriented, curious, and driven scientist or engineer to join our integrated photonics fabrication team. The successful candidate will join a close-knit, dynamic team pushing the forefront of photonic integrated circuit (PIC) platform and system development. The successful candidate will play a central role in developing PIC fabrication processes for monolithic and hybrid-integrated circuits for both classical and quantum applications. Work will focus on our 200 mm PIC fabrication platforms and will primarily be completed in our in-house Microelectronics Laboratory with support from a full team of process and equipment technicians and area engineers. Other hands-on process activities will be performed in our compound semiconductor and auxiliary fabrication spaces.

The role will include initiating and executing short-loop and full-flow fabrication runs; overseeing standard process runs to meet program needs and improve device performance, yield, and reliability; After a training period, responsibilities will include supporting our fabrication runs in the 200 mm Microelectronics Laboratory, monitoring in-line process metrology and performing a process integration role. Additionally, they will process experiments and completing independent tasks while working with a team of engineers and scientists across a range of skill and experience levels.

While some of the materials used for photonic circuits may be different from those typically used in CMOS, our fabrication leverages standard back end of line CMOS techniques including metal deposition, photolithography, and etch. We welcome applications from candidates both with and without direct experience in PIC device fab, Experience in Micro Electro Mechanical system (MEMS) fabrication is also relevant.

Qualifications

• Education: Ph.D. or M.S. in a field related to nanofabrication with at least 3 years of hands-on experience in micro/nanofabrication process engineering or process integration. Exemplary candidates with a B.S. and extensive on-the-job experience and demonstrated breadth and depth of fabrication expertise will also be considered.
• A demonstrated ability to develop and execute rigorous experimental plans
• Tool operation expertise and theoretical understanding in at least one of lithography, etch, thin films, metrology, and inspection.
• Desired: Tool operation expertise and theoretical understanding across multiple of lithography, etch, thin films, metrology, and inspection
• Demonstrated skill in Scanning Electron Microscopy (SEM)
• Experience with developing and executing standard process control
• Demonstrated process integration and 3D integration experience
• Prior experience in hybrid or heterogeneous multi-material integration (chemical mechanical polishing, surface preparation, chip-to-wafer or wafer-to-wafer bonding) of chiplets or wafers and novel material etch development and qualification is a plus.

Benefits

This range reflects base salary only and does not include additional forms of compensation or benefits. At MIT Lincoln Laboratory, you can also take advantage of other voluntary benefits, discounts and perks. Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.