PCBA Manufacturing Engineer, Amazon Leo

About the role

Aerospace Manufacturing Engineer for one or more Printed Circuit Board Assemblies (PCBA).

Responsibilities

• Work with the Design Engineering team to provide PCB/PCBA DFM feedback.
• Identify and escalate PCBA manufacturing challenges early in product development.
• Drive the PCBA Manufacturing Qualification process at the CM.
• Define manufacturing readiness requirements and lead key milestone reviews to ensure all production readiness deliverables are complete.
• Investigate and develop new manufacturing technology and methodologies to enhance PCBA quality, reliability, throughput, and cost.
• Drive closure of all operational issues during pre-production builds.
• Work within Operations, Supply Chain, R&D, and Reliability Engineering to implement and optimize manufacturing processes and improve yields for production ramp.
• Investigate failures/defects in production, test, and integration. Identify and mitigate underlying root causes to prevent reoccurrence as part of continuous improvement efforts.
• Identify opportunities for risk reduction and simplification of PCBA manufacturing processes.
• Deliver manufacturing processes capabilities including equipment capability, quality controls, materials characterization, and standardized rework practices.
• Actively monitor the success of products and processes through production ramp.
• Provide regular status reports of PCBAs progress from design to production.
• Deploy and qualify polymerics (staking, underfill, and conformal coat) equipment for high volume production.

Requirements

• 4+ years of working in PCBA manufacturing engineering or equivalent experience.
• Experience in board assembly processes and equipment: Stencil, paste print, SPI, pick & place, SMT reflow, AOI, 5DX, selective solder, flying probe, and wash.
• Experience working independently and ensuring timely and accurate communication with contract manufacturers, suppliers, and 3rd party test and failure analysis partners.

Qualifications

• Experience with IPC-A-610 Class 3, IPC J-STD-001 compliance.
• Experience in Polymeric application, including conformal coating, staking and underfill.
• Experience in solder alloys including leaded and lead free as well as next gen low temp alloys.
• Experience with flying probe test systems and DFT.

Skills

• Data-driven approach to drive manufacturability, reliability, and quality objectives in design and development teams.

Benefits

• Comprehensive benefits including health insurance, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage.
• 401(k) matching.
• Paid time off.
• Parental leave.

Pay

Base salary range: $117,300.00 - $160,000.00 USD annually.

Schedule

Up to 50% travel will be required for this role.