PCB Designer

About Roguebeam

Roguebeam is a startup developing advanced phased array systems for communications and radar applications. We design and manufacture complete systems in-house—RF, antenna, digital, and DSP—giving our engineers end-to-end ownership of the technology and a direct line of sight from algorithm to deployed system. We’re early, we’re growing fast, and the people who join us now will shape both the technology and the company.

About The Role

We're seeking an experienced PCB Designer to lead high-complexity RF and phased array board layouts. You'll work directly with antenna, RFIC, and systems engineers to translate schematics and floorplans into manufacturable, high-performance multilayer designs for satellite, HAPS/NTN, and defense applications.

Responsibilities

• Design and lay out complex multilayer PCBs for RF and mixed-signal systems using Mentor (Siemens) Xpedition
• Execute phased array panel layouts, including tightly matched feed networks, controlled-impedance routing, and lattice-spacing constraints for antenna elements
• Manage length/phase matching, impedance control, and signal integrity for high-frequency and high-speed signals
• Develop and maintain constraint sets, layer stackups, and design rules in coordination with fabrication and assembly partners
• Perform DFM/DFA/DFT reviews and work with vendors to resolve manufacturability issues
• Generate complete fabrication and assembly documentation (Gerber/ODB++, drill, fab drawings, assembly drawings, BOM)
• Collaborate with antenna, RF, thermal, and mechanical engineers on board partitioning, grounding, shielding, and thermal management

Requirements

• BSc in Electrical Engineering or a related field
• 5+ years of PCB layout experience, with demonstrated expertise in Mentor Xpedition (Enterprise/Designer flow)
• Proven experience with RF/microwave PCB design, including controlled impedance, transmission-line structures, and RF component placement
• Strong understanding of signal integrity, power integrity, and high-frequency layout techniques
• Experience with multilayer, high-density (HDI) boards and advanced stackups
• Proficiency generating industry-standard fabrication/assembly outputs and interfacing with fab houses
• Working knowledge of IPC standards (IPC-2221, IPC-7351, IPC-A-600/610)

Preferred Qualifications

• Direct experience with phased array / antenna array panel layout
• Familiarity with mmWave or high-frequency (>10 GHz) design considerations
• Experience with full-panel integration and large-format board designs
• Familiarity with RF simulation/EM tools (e.g., HFSS, ADS, EMX) and constraint-driven design flows
• Experience collaborating within an IC/RFIC design environment

Additional Notes

This role involves technology subject to U.S. export control regulations (ITAR/EAR). Applicants must be U.S. persons (U.S. citizens, lawful permanent residents, or protected individuals under 8 U.S.C.1324b(a)(3)), or otherwise eligible under applicable export authorizations.