Packaging Engineering Intern - Winter

About The Role

We’re hiring Semiconductor Packaging Engineering Interns for the winter term. The internship begins in January, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology. Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply: show us the things you’ve actually built!

Responsibilities

• Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
• Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
• Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
• Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)

Required Experience

• Pursuing a Bachelor’s Degree or higher in engineering
• At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
• Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
• Hands-on prototyping experience and the ability to move through design cycles quickly

Nice-to-have

• Proven experience in mechatronics or electromechanical system design
• Familiarity with lasering and 3D printing (stereolithography)
• Reliability testing, soldering, and reflow testing
• Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)

Working at fab2

We're an early-stage hardware startup with solid funding, world-class advisors, and offices in Austin, TX and San Francisco, CA. fab2 is committed to fair and equitable compensation. Packaging Interns are paid hourly, at a rate equivalent to an annualized range of $108,000–$126,000 depending on experience and education. Actual earnings vary with hours worked. Internship Benefits: Housing Stipend to help with first month expensesLunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and SpindriftsWeekly Learning & Development opportunitiesCommuter Benefits including Parking and Late Night Uber rides from the officePaid Time Off inclusive of Holidays and Sick TimeVisa SponsorshipMedical, Dental, and Vision insurance401(k) retirement planLife and Disability Insurance

We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses.

Export Control Analysis

This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls.

fab2, formerly known as Atomic Semi

Compensation Range: $108K - $126K