Optical Engineer

Key Responsibilities

• Lead the optical architecture and component selection for advanced transceivers (e.g., EMLs, DMLs, PDs, VCSELs, SiPh).
• Own the optical link budget and performance modeling (e.g., power, bandwidth, dispersion, coupling loss).
• Design and simulate optical systems using tools such as Zemax, Lumerical, or Synopsys RSoft.
• Define and optimize optical coupling schemes (e.g., lensed fiber, fiber array, free-space, hybrid packaging).
• Drive opto-mechanical co-design with packaging and mechanical teams, considering thermal, EMI, and signal integrity constraints.
• Collaborate with chip vendors (e.g., DSP, driver, TIA suppliers) to co-optimize the electrical-optical interface.

Process Validation & Qualification

• Define and lead the process validation plan from EVT to MP (Engineering Verification Test to Mass Production).
• Establish optical process specifications, control limits, and test coverage plans (e.g., yield, alignment, coupling).
• Drive design validation and reliability testing (e.g., HTOL, THB, TC, vibration, shock) to meet Telcordia or customer-specific standards.
• Implement DOEs (Design of Experiments) to evaluate material/process tolerances and define robust design margins.
• Work closely with the manufacturing team to validate alignment processes (e.g., active/passive alignment) and ensure automation readiness.
• Analyze yield data and perform root cause analysis on performance variances during pilot runs and production ramp.

Required Qualifications

• Master’s or Ph.D. in Optical Engineering, Applied Physics, Electrical Engineering, or a related field.
• 5+ years of hands-on experience in optical transceiver design for 100G/400G/800G or higher.
• Proven track record in the design and validation of optical modules (e.g., QSFP-DD, OSFP, CFP, COBO).
• Expertise in optical modeling, link budget analysis, and tolerance analysis.
• Strong knowledge of high-speed optical components and packaging technologies (e.g., InP, SiPh, hybrid integration).
• Familiarity with industry standards: IEEE 802.3, OIF, Telcordia GR-468, and relevant MSA specifications.

Preferred Qualifications

• Experience with CMIS, FEC, and DSP integration for PAM4 signaling.
• Familiarity with co-packaged optics (CPO) or linear-drive pluggable optics (LPO).
• Understanding statistical process control (SPC) and failure analysis (FA) techniques (e.g., microscopy, IR imaging).
• Prior experience leading cross-functional project teams or New Product Introduction (NPI) development programs.

Soft Skills

• Strong technical leadership and data-driven decision-making capabilities.
• Excellent communication and documentation skills.
• Able to lead cross-functional teams and interface effectively with external partners and customers.
• Meticulous attention to detail and a passion for high-quality engineering.

About Luxshare-Tech

Luxshare Technology, a subsidiary of Luxshare Precision, is a leading provider of communication infrastructure and enterprise-class interconnect products. We are a global designer and manufacturer of 5G communication equipment and enterprise-level interconnect solutions, including base station antennas, filters, RRUs, connectors, cables, optical modules, and AOC products. Leveraging innovative design, intelligent manufacturing, and strong partnerships, we collaborate with technology leaders to create agile, cutting-edge interconnect solutions. Our business covers global telecom and enterprise customers, with sales, service teams, and R&D centers in the Americas, Europe, and Japan, enabling fast response and on-site support worldwide. Our products are widely used in wireless communication base stations, data centers, servers, switches, and routers, offering complete solutions from wireless, electrical, and optical interconnect to thermal management.