Operator

Responsibilities

• Process products through various wafer manufacturing steps such as:
• Photolithography: Wafer preparation, photo aligner and track system operation, chemical cleaning, wafer inspection and measurement.
• Metalization: Wafer preparation, chemical cleaning, wafer loading, metal deposition and thickness measurement.
• Scribing: wafer scribing and demounting, visual inspection
• Optical layer evaporation via equipment operation, vacuum chamber
• Sawing: Wafer sawing and demounting, visual inspection, laser bar stacking, chip mounting.
• Wafer testing: testing using auto probers, visual inspection;
• Chip Testing: chip testing on manual test bench, visual inspection;
• Lapping: Wafer preparation, chemical thinning and polishing;
• Performs basic machine maintenance;
• Maintains a clean and safe workplace and observes clean room regulations;
• Must work well in a team environment;
• Performs all other related duties.

Qualifications

• Possess a High School Diploma;
• Knowledge of windows based software;
• Have good organizational skills;
• Good manual dexterity and visual acuity;
• Able to work autonomously;
• Bilingualism (French and English) an asset;
• Experience in photolithography (an asset).