Module Development Engineer, Defect Inspection

About the role

Join our Advanced Packaging Technology and Manufacturing team as a Module Development Engineer, Defect Inspection, where you will help enable next-generation semiconductor innovation. In this role, you will develop, optimize, and scale defect inspection solutions that support both current high-volume manufacturing (HVM) and future technology nodes. You will collaborate across engineering, suppliers, and research teams to improve inspection capability, drive yield improvements, and influence future process technologies.

Responsibilities

• Develop and implement defect inspection and metrology technologies for semiconductor manufacturing.
• Design and optimize processes, inspection methods, and equipment performance.
• Conduct process experimentation and feasibility studies using statistical and engineering methods (DOE, SPC).
• Collaborate with equipment and materials suppliers to introduce new technologies.
• Analyze defect data to identify root causes and improve yield and quality.
• Drive continuous improvement of inspection systems through automation, software, and hardware enhancements.
• Support technology pathfinding and roadmap development for next-generation products.
• Stay current with industry trends, emerging tools, and inspection methodologies.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

• Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related field + 4 years of experience.
• Or a Master's degree in the same field with 3+ years of experience and a PhD in the same field with 2+ years of experience.
• Your experience must include semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Experience with Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

Skills

Behavioral traits that we are looking for:

• Collaborate effectively across teams and disciplines.
• Show curiosity and continuous learning mindset.
• Demonstrate strong analytical and problem-solving skills.
• Adapt to changing priorities in a dynamic environment.
• Communicate technical concepts clearly to diverse audiences.
• Take ownership and accountability for results.
• Drive innovation while maintaining attention to detail.

Preferred qualifications and experience:

• Demonstrated ability to troubleshoot manufacturing processes and equipment.
• Experience with packaging processes, equipment automation development, or project management in technology development.
• Previous related work experience in a semiconductor foundry preferred.

Benefits

Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life. See Intel Benefits for more details.

Pay

Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 188,890.00 USD. The range displayed reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role will require an on-site presence (Shift 1 in the United States of America).