Jobs · Engineering · California

mmWave IC Design Engineer - TeraWave

Blue Origin · San Francisco Bay Area · 2 days ago
On-siteEngineering$230k–$323k/yrFull-time

About the role

Blue Origin is seeking an mmWave IC Design Engineer to drive the development of state-of-the-art RF/mmWave integrated chips. The role involves designing cutting-edge integrated front-end circuits and collaborating with RF system engineers to architect transmitter and receiver front-ends.

Responsibilities

  • Design state-of-the-art RF/mmWave front-end chipsets, including power amplifiers, low-noise amplifiers, phase shifters, variable-gain amplifiers, mixers, multipliers, and synthesizers.
  • Partner with RF system engineers to run feasibility studies and architect RF/mmWave transmitter and receiver front-ends, translating system-level requirements into chip-level specifications.
  • Design and simulate on-chip electromagnetic (EM) structures and collaborate with the package engineering team on co-optimization of IC/package interfaces.
  • Supervise chip-level front-end integration and optimization throughout the development lifecycle and ensure successful production.
  • Work with third-party design partners.

Requirements

  • Bachelor's degree in Electrical Engineering, or related technical discipline.
  • 7+ years of experience in millimeter-wave/RFIC design using SiGe, CMOS, and SOI technologies.
  • Strong experience with various circuit topologies for amplifiers, mixers, switches, and synthesizers, specifically at mmWave frequencies with fully integrated on-chip implementations.
  • Proven expertise in the analysis and optimization of transmitter and receiver front-ends for complex modulated waveforms, including practical modeling and circuit simulations of TX/RX chains with time-sampled waveforms.
  • Hands-on experience in mmWave IC characterization and debugging.
  • Experience with analog building blocks such as operational amplifiers, bias generators, temperature sensors, LDOs, and ADC/DAC implementations.
  • Proficiency in EM simulations for both on-chip and package components.
  • Prior experience with top-level integration, including ESD, mixed-signal/mixed-mode verification, and DFM concepts.
  • Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Qualifications

  • Advanced degree (MS/PhD) in Electrical Engineering or related field preferred.
  • Experience with beamforming front-ends and phased array implementations preferred.
  • Experience in high-performance IC development using III-V technologies (e.g., GaAs, GaN) preferred.
  • Strategic mindset and strong communication skills, with the ability to collaborate across functions and drive complex projects to completion.
  • Experience mentoring early-career engineers preferred.

Pay

Base Pay Range For CA applicants is $230,398.00 - $322,556.85 WA applicants is $230,398.00 - $322,556.85 Other Site Ranges May Differ

Schedule

Based on weekly scheduled hours, and up to 14 company-paid holidays.

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