Mixed-Signal Chiplet Architect

Key Responsibilities

• Define the architecture of analog and mixed-signal transceiver chiplets for advanced heterogeneous integration.
• Develop system-level specifications, interface definitions, and performance requirements.
• Develop sub-system requirements within the chiplet to achieve system level performance goals.
• Work with software architects to define and develop software and firmware for fast configuration and real time chiplet control.
• Guide design teams in integrating analog building blocks (e.g. RFADCs/RFDACs, Bias circuits, clock structures, PLLs, LDOs, drivers).
• Collaborate with digital, RF, and packaging teams to ensure seamless chiplet operation and interoperability.
• Work with system engineers to define and integrate fast switching clock synchronization schemes.
• Oversee system-level verification, modeling, and simulation of multi-chiplet systems.
• Drive signal integrity, power integrity, and thermal considerations at the multi-chiplet level.
• Stay at the forefront of industry trends in chiplet architectures, heterogeneous integration, and advanced packaging.
• Contribute to the company’s technology roadmaps, identifying opportunities for differentiation in performance, efficiency, and scalability.
• Communicate complex trade-offs and recommendations to management.

Qualifications

• Education: MS or PhD in Electrical Engineering or Systems Engineering.
• Experience: 10+ years of experience in analog/mixed-signal IC design, with at least 3 years in chiplet or multi-die system architecture.
• Track record of architecting and delivering high-performance analog ICs.
• Experience with advanced packaging and chiplet-based integration.
• Technical Expertise: Strong foundation in analog/mixed-signal circuit design (ADC/DACs, Clocking, Biasing, Digital, and software/firmware based control).
• Knowledge of die-to-die interconnect protocols a plus.
• Familiarity with EDA tools for circuit, system, and packaging co-simulation.
• Soft Skills: Strong leadership, problem-solving, and communication skills.
• Ability to balance innovation with practical constraints in time-to-market and manufacturability.