Microelectronics Supply Chain Management Expert (SME)

Position Overview

TAP Engineering is seeking a highly specialized Microelectronics Supply Chain Management Expert to support a Major U.S. Strategic Defense Agency on a high-priority homeland modernization initiative.

Key Responsibilities

• Provide expert technical assessments of current and emerging microelectronics fabrication technologies, specifically focusing on radiation-hardened components, heterogeneous integration (2.5D/3D packaging), and Read-Out Integrated Circuit (ROIC) technologies for advanced sensing.
• Develop and execute strategies to mitigate vulnerabilities in the global microelectronics trade flow, identifying risks related to sole-source foundries and obsolete components.
• Critical Initiative Support: Coordinate with subawardees and prime contractors under a mission-critical IDIQ to ensure adherence to rapid delivery timelines while maintaining hardware integrity.
• Assist the government in managing domestic microelectronic design and fabrication pipelines, ensuring traceability and quality assurance from initial chiplet design to final system integration.
• Implement and monitor hardware Root of Trust protocols and anti-counterfeit measures, as well as the implementation of hardware-level secure enclaves for trusted execution.
• Act as a technical liaison between the supply chain management office, the Defense Industrial Base (DIB), and other DoD entities.
• Author technical reports and trend analyses to brief senior government officials on the health and capacity of the microelectronics industrial base.

Required Qualifications

• Active TS/SCI clearance
• U.S. Citizenship required
• BS in Electrical Engineering, Materials Science, or a related technical field (MS preferred)
• 10+ years of experience in microelectronics hardware, with at least 5 years specifically focused on semiconductor supply chain management or fabrication oversight
• Familiarity with advanced PCB and FPGA-chiplet centric architectures
• Technical understanding of Read-Out Integrated Circuit (ROIC) design and fabrication for focal plane arrays and infrared sensors
• Knowledge of hardware-based secure enclave architectures and trusted execution environments (TEE) for mission-critical data protection
• Direct experience with radiation-hardening processes for commercial microelectronics in high-reliability and strategic environments
• Understanding of Trusted Foundry requirements and Defense Microelectronics Activity (DMEA) accreditation processes
• Proven ability to mentor junior team members and brief senior-level government executives on complex technical trade studies

Desired Qualifications

• MS or PhD in Electrical Engineering or a related technical field
• Direct experience supporting strategic defense programs or major DoD-led microelectronics initiatives
• Experience implementing ISO 9001 and AS 9120 standards for quality and supply chain inspection

Clearance Requirement

This position is contingent upon the successful completion of security processing and favorable acceptance onto the program by the Customer. This position requires the ability to obtain and maintain a Top Secret/SCI security clearance, based on a current background investigation (SBI).

Factors considered for a U.S. Government Security Clearance include, but are not limited to: U.S. Citizenship (Required), Favorable Criminal History Check, Education Verification, Abuse/Illegal Drug Use, Credit Check, Subject Interview.