Mechanical Engineer

Responsibilities

• Design, develop, modify and evaluate electronic packaging for use in Mil/Aero applications
• Model components and systems as well as create drawing packages for fabrication
• Apply Design for Manufacturability (DFM) and Design for Assembly (DFA) techniques on both new and existing products to produce optimal design and manufacturing solutions
• Support vibration and thermal testing
• Maintain responsibility of product from concept to production
• Interface with customers and vendors to ensure product/component performance is to customer specifications and to appropriate standards

Requirements

• B.S in Mechanical Engineering from an accredited university
• 3-7 years of commensurate industry experience in analysis, design, and packaging of electronics hardware and/or systems
• Basic understanding of machining and electronic system manufacturing processes
• Understanding and Application of Geometric Dimensioning and Tolerancing (GD&T)
• Ability to read and generate mechanical drawings
• Ability to obtain and maintain a DoD Security Clearance

Qualifications

• U.S. Citizenship required

Preferred Qualifications

• Proficiency with SolidWorks, Solid Edge, Pro-E, or other 3D modeling software
• Experience with military electronics packaging including RF, microwave, analog or digital assemblies and subassemblies
• Knowledge of PLM, PDM, and configuration control process
• Knowledge of military finishes
• Familiar with Dynamic and Thermal Testing

Benefits

TSC offers a stable work environment, a competitive salary, and a comprehensive benefit package; including ESOP participation, 401k Plan, Flexible Work Schedules, Tuition Reimbursement, Co-Sponsored Health Plan, Paid Leave and much more.

Pay

TSC does not specify pay details.

Schedule

TSC does not specify schedule details.