Mechanical Engineer, Annapurna Labs, Machine Learning Hardware

About the role

Annapurna Labs (our organization within Amazon) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

As a member of the Machine Learning Acceleration team, you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large-scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products' performance, quality, and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Responsibilities

• Design and build thermal and mechanical systems that are the heart of the world's largest and most powerful computing infrastructure.
• Develop from the lowest levels of circuit design to large system design and see those systems all the way through to high-volume manufacturing.
• Perform thermal and performance measurements and characterization on SoCs, servers, and systems.
• Conduct SoC thermal modeling and IC package transient thermal response analysis.
• Design chip packages, system mechanical, and thermal solutions for air-cooled and liquid-cooled systems.
• Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams.
• Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organizations.
• Develop detailed CFD and compact RC models for SoC and package thermal analysis.
• Optimize thermal solutions under PPA (Power, Performance, Area) and system design constraints.
• Simulate and prototype thermal control strategies.
• Validate thermal models through power and thermal measurements on hardware.

Requirements

• BS or MS degree in Mechanical/Thermal Engineering.
• 3+ years of industry experience in mechanical and thermal design of systems.
• Experience in thermal and performance measurements and characterization on SoCs, servers, and systems.
• 3+ years of experience in SoC thermal modeling and IC package transient thermal response.
• Experience with chip package, system mechanical, and thermal design for air-cooled and liquid-cooled systems.

Preferred Qualifications

• Knowledge of SoC thermal/mechanical design methodology, power modeling, and thermal analysis techniques.
• Tool familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks.
• Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in a Linux environment is an added advantage.
• Working knowledge of fans, valves, chillers, and CDUs (Coolant Distribution Units).
• Knowledge of various types of technologies used for heatsink solutions, Thermal Interface Materials (TIMs), and liquid cooling technologies.
• Knowledge of hardware and software-based thermal/power management control algorithms.

Pay

USA, TX, Austin - $136,000.00 - $184,000.00 USD annually

USA, WA, Seattle - $136,000.00 - $184,000.00 USD annually

Benefits

• Comprehensive health insurance (medical, dental, vision, prescription, basic life & AD&D insurance, and optional supplemental life plans).
• Employee Assistance Program (EAP) and mental health support.
• Medical advice line.
• Flexible Spending Accounts.
• Adoption and surrogacy reimbursement coverage.
• 401(k) matching.
• Paid time off and parental leave.
• Sign-on payments and restricted stock units (RSUs).

Learn more about our benefits.