Manufacturing Process Engineer II - IRP

About the role

As the IRP (Inspection, Repair, and Printability) Repair Engineer, you’ll play a critical role in ensuring the quality and performance of photomasks used in advanced semiconductor manufacturing. This position spans defect inspection, precision repair (e-beam and AFM), and final printability validation to drive yield and product performance. The role is responsible for end-to-end quality assurance of photomasks and reticles used in advanced semiconductor manufacturing - from incoming defect inspection and classification, through precision repair using electron-beam (e-beam) etch techniques and atomic force microscope (AFM) nanomachining, to final printability verification and yield impact assessment. The IRP Engineer owns inspection, repair, and printability capability for assigned IRP toolsets, including long-term health, stability, and continuous improvement, and define and maintain process windows, control plans, and BKMs for IRP inspection and repair equipment, proactively identifying risks to capability or throughput. The IRP Engineer works in a cleanroom environment and collaborates closely with process integration, equipment, and lithography engineering teams to sustain and improve photomask quality, cycle time, and overall fab yield. This position requires a deep understanding of photolithography processes, mask defect physics, and related fabrication tools and equipment, combined with precision hands-on repair skills and strong data analytics capabilities.

Location: Boise, ID (US). This is an on-site position, and we are not open to remote candidates at this time. Travel: Less than 5%.

Responsibilities

• Perform incoming and in-process inspection of photomasks and reticles using optical inspection systems
• Classify defect types (intrusions, points defects, particles, phase errors) and assess severity and printability risk using scanning electron microscopy, and aerial image simulation tools
• Conduct reticle qualification, check node-specific specifications for defectivity and pattern fidelity requirements to determine ready for wafer exposure
• Develop, qualify and sustain photomask defect repair capabilities using e-beam etch, and/or AFM nanomachining repair platforms to address opaque and clear defect modes across chrome-on-glass, phase-shift and EUV mask types
• Characterize repair process windows and recipe sensitivities as a function of defect geometry, height, transmission and local pattern context; optimize repair strategies to minimize collateral damage and printability risk
• Perform post-repair inspection and verification to confirm defect removal effectiveness, pattern fidelity, and repair repeatability, feeding results back into capability improvement
• Document and maintain repair learnings, qualified recipes, and known limitations to support consistent execution, training, and continuous improvement
• Conduct printability analysis using AIMS (Aerial Image Measurement System) to measure wafer impact from reticle defects before and after repair
• Collaborate with photolithography and process engineers to determine disposition of defects: repair, use-as-is, or scrap
• Support mask qualification for new technology nodes and production processes, including review of critical dimension (CD) and overlay performance data
• Use SPC, FMEA, and DOE outputs to make independent engineering decisions regarding process stability, defect disposition, and repair strategy
• Partner with process engineering on failure analysis investigations, implementing corrective actions to reduce defect density and mask cycle time
• Lead process changes from concept through qualification and production release, ensuring stakeholder alignment, risk mitigation, and documentation updates
• Author and maintain standard operating procedures (SOP), work instructions, and qualification protocols for inspection, repair, and printability workflows
• Develop and deliver training materials and hands-on instruction for technicians and junior engineers on inspection, repair, and printability best-known methods
• Interface with photomask suppliers, OEM technical support teams, and internal process/integration engineers to resolve escalated quality issues
• Participate in cross-functional design-for-manufacturability (DFM) reviews, new product introductions (NPI), and technology transfer activities

Qualifications

• Experience with photomask, reticle, or semiconductor inspection/repair processes, or similar precision manufacturing environments; understanding of defect types and quality impact is preferred.
• Working knowledge of semiconductor manufacturing or photolithography processes (e.g., track, exposure, or related systems) or equivalent experience in microfabrication or advanced manufacturing.
• Strong technical documentation skills with the ability to create clear procedures, reports, and work instructions.
• Ability to analyze process performance and trends using data; familiarity with SPC or similar methodologies is a plus