Manufacturing Engineer 2nd Shift

Stellant is seeking a Manufacturing Engineer to support Electronic Power Conditioner (EPC) assembly and test at our Torrance, CA facility. This role focuses on Printed Circuit Board Assembly (PCBA), Surface Mount Technology (SMT) applications, and the intricacies of building PCBAs and completed high-voltage EPCs for space applications. Stellant’s industry-leading EPCs have supported spaceborne communications for over three decades, with more than 4,700 units in orbit and 290 million operating hours. The role may also support terrestrial applications such as RF communications, electronic warfare, and radar in our Microwave Power Modules (MPMs).

Responsibilities

• Work with suppliers and internal production teams to develop, manage, and improve the PCBA manufacturing process.
• Validate new equipment and processes, and continuously seek to improve production efficiency and quality.
• Support PCBA manufacturing processes and products, including die-bonding and wire bonding assembly.
• Collaborate with multidisciplinary teams to develop wire bond solutions and provide training in die-assembly, wire bond technology, problem analysis, and resolution.
• Provide technical guidance on the manufacturing floor and support investigations with engineering teams.
• Communicate with vendors and provide customer support as needed.
• Support integration and testing of completed traveling wave tube amplifiers (TWTAs) and MPMs.
• Estimate manufacturing costs and determine time standards for tooling and process requirements.
• Manage work instructions, process documentation, and training for internal teams and suppliers.
• Identify trends and opportunities for optimizing product output, quality enhancements, and cost of manufacturability.
• Provide feedback to the Engineering Design team to improve design for manufacturability.
• Identify, root-cause, and correct SMT production and testing issues.
• Drive corrective actions and process improvements for owned processes and products.
• Support mechanical assembly of precision microwave parts, including channel amplifiers, linearizers, and HI-REL RF housing fabrication.
• Support MIC assembly processes such as brazing, die attach, wedge-wedge bonding, and gap welding.
• Support electrical testing and tuning changes.

Requirements

• Relevant engineering experience in manufacturing engineering of PCBAs, microelectronics, or similar processes.
• Bachelor’s degree in mechanical, manufacturing, or electrical engineering.
• Experience levels:
  • Level II: Minimum 2 years of relevant experience.
  • Level III: Minimum 4 years of relevant experience.
  • Level IV: Minimum 6 years of relevant experience.
• Strong verbal and written technical communication skills.
• Ability to interpret schematics, engineering drawings, and product specifications.
• Basic knowledge of GD&T (Geometric Dimensioning and Tolerancing).
• Strong analytical, fault isolation, and problem-solving skills.
• Experience in process design, development, and project planning.
• Experience preparing and maintaining assembly instructions, drawings, procedures, process routers, and Bills of Materials with a strong understanding of configuration management.
• Ability to develop and execute Statistical Process Control (SPC) for manufacturing.
• Experience in secondary operations including manual soldering, point-to-point wiring, and solder rework station processes.
• Understanding of material behavior such as thermal fatigue and solder creep (preferred).
• Understanding of multilayer and rigid-flex PCB manufacturing processes (preferred).
• Knowledge of solder joint reliability and fatigue characteristics (preferred).
• Ability to work under a microscope for extended periods and demonstrate eye-to-hand dexterity and fine motor skills.
• Ability to work in a fast-moving environment under tight schedules and coordinate multiple tasks effectively.

Pay

$80,000–$130,000/year, depending on experience and level.