Low-Temperature Bonding Engineer

About the role

GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to join the Quantum Advanced Packaging team. This role involves enabling next-generation assembly scaling development efforts in the Advanced Packaging and Photonics Center (APPC) and with partners. The primary responsibility is to develop low-temperature bonding processes, support advanced die assembly technologies, and associated assembly equipment.

Responsibilities

• Develop and optimize low-temperature bonding processes for quantum packaging applications.
• Support assembly process development (in bonding, superconducting metal bonding, thermo-compression bonding, hybrid bonding, etc.).
• Characterize bond quality, electrical performance, mechanical integrity, and reliability under cryogenic operating conditions.
• Define process windows and critical-to-quality parameters for production-worthy assembly processes.
• Own assembly process modules from development through qualification.
• Execute process experiments and Design of Experiments (DOE) activities to improve process capability and robustness.
• Work with test and systems teams to ensure assembled hardware meets: Cryogenic reliability across thermal cycles, Electrical and RF/microwave integrity requirements.
• Work with equipment teams to define requirements for: High-precision alignment / bonding tools, Cryogenic-compatible materials handling.
• Contribute to the APPC / Quantum packaging roadmap and capability build-out.
• Provide clear technical updates, data analysis, and reports to stakeholders.
• Support IP generation, publications, and conference contributions.

Qualifications

• Education: Bachelor’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. BS degree with at least 4 years of prior related work experience.
• In-depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
• Strong problem-solving and technical trouble-shooting skills including expertise in design of experiment.
• At least an overall 3.0 GPA and proven good academic standing.
• Language Fluency: English (Written & Verbal).
• Travel: Up to 10%.

Preferred Qualifications

• Education: MS education level preferred with at least 2 years of prior related work experience.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning & organizational skills.

Benefits

The exact Salary will be determined based on qualifications, experience and location. An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.