Jobs · Business Development · California

Japanese Bilingual Field Application Engineer

Top-Us · Santa Clara, CA · 1 mo ago
Business Development$140k/yrFull-time

Responsibilities

  • Present detailed technical product presentations to key customer engineers at different levels in multiple meetings, working toward design-in products.
  • Show strong technical strengths in device physics of magnetic semiconductor components.
  • Have strong communication skills; enjoy working with engineers and technology.
  • Work closely with colleagues in engineering, sales, and marketing teams to provide technical support throughout the product lifecycle.
  • Work closely with customers during the design phase, understanding the full scope of their requirements to help guide the development teams.
  • Work closely with the development teams to assist in the validation process.
  • Participate in new product design reviews both internally and externally.
  • Participate in supporting factory audits and customer visits internationally.

Qualifications

  • Strong knowledge of semiconductor device processing and core electrical engineering concepts.
  • Technical background and knowledge of:
    • Magnetic device design, process, and characterization: Magnetic sensor design and modeling;
    • Si or compound semiconductor front and back-end process technology;
    • Device characterizations such as sensitivity, linearity, temperature, and noise characterization.
  • Prior customer engagement experiences with the ability to make detailed technical presentations in concise and timely manner to customers.
  • Fluent in both English and Japanese (written/oral) for technical engagements with our Japanese counterparts.
  • Ability to travel internationally as much as 5~6x/year to accommodate customer visits and factory audits.

Preferred Requirements/Skills

  • Experience in failure analyses and reliability of device physics.
  • Knowledge of failure analysis equipment such as SEM/EDX, OBIRCH, FT-IR spectroscopy.
  • Able to highlight technical gaps between customer requests and internal capabilities in resolving issues.

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