Internship: Embedded Software Engineering

Position Overview

The Embedded Software Engineering Intern is an integral part of a multi‑disciplined new product engineering team at Eaton’s Thomas A. Edison Technical Center in Franksville, WI (about 20 miles south of Milwaukee). This twelve‑week paid internship provides hands‑on experience with core engineering competencies and a holistic view of technology‑driven solutions for Eaton’s utility, commercial, and industrial customers.

Responsibilities

• Work with hardware drivers and embedded applications, networking, and related areas primarily using C, C++, and Python (or other programming languages).
• Collaborate with global multi‑discipline engineering teams (software, embedded software, hardware, power systems, systems, product, and test) to deliver products and features for the Utility Intelligent Devices team.
• Perform engineering analyses, create designs, and develop unit tests contributing to New Product Development (NPD) projects and functional initiatives.
• Set aggressive goals, measure performance, and strive to exceed expectations.
• Effectively work and communicate within a global team environment.

Required Qualifications

• Actively enrolled in or have received a bachelor’s or master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Software Engineering, or Computer Science from an accredited institution.
• Graduation date no earlier than December 2027.
• Minimum GPA of 2.8.
• Eaton will not provide immigration sponsorship or support for CPT, OPT, STEM OPT, H‑1B, O‑1, E‑3, TN, or related status changes.

Preferred Qualifications

• Prior internship or co‑op experience.
• Junior standing or higher.
• Minimum GPA of 3.2.
• Experience developing with C/C++, Python, or other programming languages.
• Familiarity with Agile Scrum or other iterative development methodologies.

Pay

The salary for this role ranges from $22.15 – $37.50 per hour, depending on your year in school.

Benefits

• Relocation assistance for qualified candidates (lump‑sum payment via Eaton’s relocation vendor).
• Competitive total rewards package consistent with internal and external market practices.