Integration Engineer (52203)

Under the direction of the Sr. Manager of Reader Integration, the Integration Engineer is responsible for the process integration and characterization of prototype wafers for new technology programs and next-generation projects.

Responsibilities

• Develops and delivers process integration and characterization techniques for new technology programs and next-generation products.
• Designs and conducts experiments to verify process robustness; analyzes data and performs FMEA to meet product requirements.
• Works on characterization or integration projects of various scope and complexity; ensures completion within established timeframes.
• Conducts failure analysis on newly developed processes and recommends corrective action if necessary.
• Performs wafer-level process characterization on thin-film recording heads using Focused Ion Beam (FIB) tool and CD-SEM to identify defects and provide corrective actions.
• Reviews and analyzes backend performance data and makes recommendations to improve performance.
• Analyzes data using JMP, MS Visual Basic, or similar software to determine the root cause of process variations; develops charts or reports and presents findings.
• Responds to inquiries from other team members, managers, or departments.
• Adheres to all safety policies and procedures.
• Performs other duties of a similar nature or level.

Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s or PhD preferred.
• Three years of hands-on experience working in process integration or characterization in a semiconductor environment in a manufacturing or process engineering role.
• Hands-on experience using JMP or similar analytical applications.
• Proficient in the use of Microsoft Office applications.

Skills

• Knowledge of process integration and characterization principles, practices, and techniques.
• Knowledge of magnetic recording head or HDD manufacturing.
• Able to design experiments, analyze results, and recommend corrective action.
• Strong communication skills, both verbal and written, with all levels of employees and management.
• Able to work productively and collaboratively with all levels of employees and management.
• Strong critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements.
• Demonstrated analytical, organizational, and time management skills.
• Demonstrated problem-solving and troubleshooting skills.
• Flexible and able to prioritize.

Working Conditions

• Primarily works in an office environment Monday through Friday; schedule may occasionally be altered to meet business or operational needs.
• Works in a class 100 ESD-sensitive wafer manufacturing facility; required to wear a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask.
• May be exposed to hazardous conditions, chemicals, fumes, gases, and loud noise.
• Involves standing, walking, bending, twisting, and crawling; performs fine grasping movements and operates office equipment.
• May occasionally push, pull, or lift up to 20 pounds.

Pay

The annual base salary for this full-time position is between $120,819.00 and $177,675.00, plus bonus target and benefits. Individual pay within this range may differ based on job responsibilities, knowledge, skills, abilities, education, and experience.