Integrated Photonics Engineer

About the role

Develop the photonic integrated circuit (PIC) technology at the heart of Azora's high-sensitivity optical transceivers. You will design, simulate, and characterize integrated photonic devices and modules; shepherding them from foundry tape-out through packaging and system integration.

Responsibilities

• Design and simulate integrated photonic components and circuits: waveguides, couplers, 90° hybrids, MZI modulators, phase shifters, photodetector interfaces, and on-chip filters.
• Own foundry tape-outs on silicon photonics, SiN, or InP platforms, including DRC, layout, and process design kit (PDK) workflows.
• Develop test plans and carry out wafer- and chip-level characterization: insertion loss, polarization behavior, bandwidth, responsivity, and phase noise.
• Work with packaging partners on fiber attach, hermetic packaging, and co-packaging with electronics for space environments.
• Integrate PICs into coherent and photon-counting receiver chains and validate end-to-end sensitivity against quantum-limit targets.
• Assess radiation tolerance and thermal behavior of photonic devices for flight applications.
• Collaborate with mixed-signal and FPGA engineers on driver/TIA interfaces and DSP requirements.

Requirements

• MS/PhD in Photonics, Electrical Engineering, Applied Physics, or related field (or equivalent industry experience).
• 3+ years of hands-on PIC design and characterization experience.
• Proficiency with photonic simulation and layout tools (Lumerical, Synopsys, KLayout, IPKISS, or similar).
• Experience with at least one commercial foundry PDK and tape-out cycle.
• Strong lab skills: fiber alignment, RF probing, optical test instrumentation (OSA, LCA, tunable lasers).

Preferred Experience

• Coherent optical communications (DP-QPSK/QAM, DSP-based receivers) and/or photon-counting detection.
• Free-space-to-chip coupling, optical phased arrays, or integrated beam steering.
• Space qualification of photonic components (radiation, TVAC, vibration).
• Hybrid integration (III-V on Si, micro-transfer printing) or co-packaged optics.

Location

This is an onsite/hybrid role based in Tempe, AZ or the Bay Area, CA. Some travel expected for field deployment and vendor/manufacturing visits.

Benefits

• Generous equity
• Competitive healthcare (including options for vision and dental)
• 401(k)
• Unlimited PTO

To conform to U.S. Government export regulations, applicants must be a (i) U.S. citizen or national, (ii) U.S. lawful permanent resident, (iii) protected individual as defined by 8 U.S.C. 1324b(a)(3), or (iv) be eligible to obtain the required authorizations from the U.S. Department of State.