III-V Device Design Engineer for Silicon Photonics Integration

About the role

Skorpios Technologies, Inc. is seeking a top-level III-V Device Design Engineer to develop next-generation Si Photonics chip and module products. This role offers the opportunity to work with a highly motivated, high-performance technical team on highly differentiated, disruptive technology within our Integration and Process Development Engineering team.

Responsibilities

• Design, model, and simulate high-efficiency lasers, EAM and MZM high-speed modulators, and Uni Traveling Carrier high-speed photodetectors.
• Model and simulate resistance and capacitance effects from EAM and MZM modulators, photodiodes, and laser diodes to improve RF performance in integrated circuits.
• Perform impedance matching over a large frequency range.
• Establish tolerance and process design rules to enable DRC for designs and layouts.
• Direct HPIC layout of designed components.
• Design DOE and perform design validation testing.
• Support design reviews and presentations.
• Design for manufacturability (DFM).
• Establish schematic designs for layout.
• Use computer software to design III-V components and optimize RF performance and optical-to-electrical conversion efficiency.
• Conduct RF device testing, electrical/optical s-parameter measurement, and characterization.

Requirements

• 10+ years of experience in a relevant field.
• M.S. or Ph.D. in Physics, Electrical Engineering, Material Science, or a related field with emphasis on photonics, optical communications, and high-speed optical III-V components.
• Deep understanding of lasers, MZM, photodiodes, and EAM devices.
• Extensive industrial experience in photonics (Si or III-V) device design and characterization, with a proven track record from concept to manufacturing. Alternatively, a Ph.D. graduate with outstanding research in directly related devices may be considered.
• Solid understanding of epitaxy constraints, band structures, quantum effects, carrier diffusion, and optical modes for optical communications.
• Experience designing various III-V devices, including high-power and high-efficiency lasers, EAM and MZM high-speed modulators, and Uni Traveling Carrier high-speed photodetectors.
• Proficiency in design and simulations for III-V active photonic devices.
• Familiarity with optoelectrical device characterization and analysis.
• Understanding of component reliability concepts.
• Able to work with processing engineers to define fabrication methods.
• Strong problem-solving skills with a demonstrated track record.
• Able to thrive in a dynamic start-up environment.
• Excellent verbal and written communication skills.

Skills

• Ability to work in an integrated and diverse team environment.
• Proficiency with large datasets and statistical analysis tools, with the ability to present data to diverse audiences.
• Strong III-V and RF design circuitry skills.
• Problem-solving and troubleshooting skills.
• Proficiency with Microsoft Excel and software design tools like Ansys Lumerical.
• Interpersonal, verbal, and written communication skills.

Preferred Qualifications

• Significant industrial experience in the III-V components industry.
• Experience with Ansys Lumerical, Zemax, Speos, JMP, or Mini-Tab.

Work authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.