High-Speed Circuit Design Engineer (7261)

Overview of Role

As a High-Speed Circuit Design Engineer and Team Manager, you will participate in R&D activities focusing on high-speed wireline and optical interconnects using fundamental analog circuit techniques and communication theories. Your responsibilities include evaluating PPA of circuit-level novelties and tapeouts for next-generation high-speed electrical and optical interconnects, working with multidisciplinary teams to translate design/system requirements into process technology requirements through Design/System and Technology Co-Optimization (DTCO/STCO), engaging with academic and industrial partners on exploratory research topics, and developing key technical insights. You will also lead and coach a small team, collaborating with peer teams to foster growth and innovation.

Responsibilities

• Evaluate PPA of circuit-level novelties and tapeouts for next-generation high-speed electrical and optical interconnects
• Work with multidisciplinary teams to translate design/system requirements into process technology requirements through DTCO/STCO
• Engage with university and industry partners on exploratory research topics and develop key technical conclusions
• Convert results of innovative works into patents, IP, or test-chips, and publications
• Lead and coach a small team of people and collaborate with peer teams

Requirements

• MS/PhD degree in Electrical/Electronics Engineering
• Solid background in analog circuit design, preferably in wireline I/F, SerDes, silicon photonics, or data converters

Preferred Qualifications

• 15+ years of hands-on experience in designing high-speed/high-frequency circuits
• Basic understanding of communication theory, termination, channel analysis, clock jitter, low power design, chiplets, serdes, co-packaged optics, data converters, error correction, and equalization
• Experience with custom analog design/layout and tape-out tooling
• In-depth knowledge in your field, with fast learning ability and problem-solving skills, and willingness to explore new territories and make critical decisions

Company Description

TSMC is a trusted technology and capacity provider, driven by the desire to be: The world’s leading dedicated semiconductor foundry, The technology leader with a strong reputation for manufacturing excellence, Advancing semiconductor manufacturing innovations to enable the future of technology. Founded in 1987, TSMC has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world. In North America, TSMC has a strong sales and service organization that works with customers by helping them achieve silicon success with cutting-edge technologies and manufacturing excellence. The Company continues to accelerate its R&D investment and staffing in recent years and is expanding its manufacturing footprint to support customer innovation with 3D IC technologies and optimal manufacturing capacity.

Diversity Statement

TSMC Technology, Inc. is committed to employing a diverse workforce and providing Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law. TSMC is an equal opportunity employer prizing diversity and inclusion. We are committed to treating all employees and applicants for employment with respect and dignity.

Pay Transparency / Benefits Statement

At TSMC, your base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a base salary between $153,500 and $245,000 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience, and the position level and location. TSMC’s total compensation package consists of market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs.