HBM SIPI, Principal Engineer

Responsibilities

Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency- and time-domain evaluation
Define and drive power delivery architecture, impedance targets, and transient analysis
Perform electromagnetic extraction and modeling across PCB, package, and interposer designs
Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs
Provide clear technical direction in ambiguous or incomplete design environments

Requirements

• 7 years of experience in signal integrity and power integrity modeling and analysis
• Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design
• Hands-on experience with industry-standard SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight
• Experience with 2.5D/3D advanced packaging technologies such as interposer-based designs
• Experience working with high-bandwidth interfaces including HBM, DDR, SERDES, or UCIe
• Direct ownership of system-level SI/PI sign-off for production silicon
• Scripting experience with TCL and/or Python to automate SI/PI analysis flows

Qualifications

• 10+ years of experience in SI and PDN modeling and analysis
• Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design
• Hands-on experience with industry-standard SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight
• Experience with 2.5D/3D advanced packaging technologies such as interposer-based designs
• Experience working with high-bandwidth interfaces including HBM, DDR, SERDES, or UCIe
• Direct ownership of system-level SI/PI sign-off for production silicon
• Scripting experience with TCL and/or Python to automate SI/PI analysis flows

Skills

• Signal Integrity and Power Integrity Modeling
• Electromagnetic Extraction and Modeling
• EDA Tools (ANSYS, Synopsys, Cadence, Keysight)
• 2.5D/3D Advanced Packaging Technologies
• High-Bandwidth Interfaces (HBM, DDR, SERDES, UCIe)
• System-Level Sign-Off
• Automation Scripting (TCL, Python)

Pay

The US base salary range that Micron Technology estimates it could pay for this full-time position is: $175,000.00 - $309,000.00 a year

Schedule

Not specified

Benefits

Additional Compensation May Include Benefits, Bonuses And Equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs.

Equal Opportunity Employer

Micron is an equal opportunity employer and is committed to providing an environment of respect and ensuring that all decisions are based on merit, competence and performance. We prohibit discrimination and harassment of any kind based on race, color, sex, religion, sexual orientation, national origin, disability, genetic information, pregnancy, or any other protected characteristic as outlined by federal, state, or local laws.