Fabrication R&D Scientist, Amazon Center for Quantum Computing

About the role

The Amazon Center for Quantum Computing in Pasadena, CA, is seeking a Fabrication R&D Scientist with expertise in semiconductor process development to contribute to Amazon's mission of bringing cloud quantum computing services to its global customer base. This role involves working alongside a multidisciplinary team of scientists, hardware, and software engineers focused on advancing quantum computing technology.

Responsibilities

• Develop and optimize processes to fabricate high-coherence superconducting qubits
• Develop advanced 3DI interconnect and routing technologies for integrating superconducting quantum technologies
• Analyze inline metrology and electrical test data
• Develop and maintain integration documentation, design rules, and standard operating procedures
• Interact with project leads to provide feedback that continuously improves different processes
• Stay updated with the latest advancements and industry trends in process integration and apply knowledge to improve processes and drive innovation
• Provide technical guidance and support to junior colleagues, fostering a collaborative and knowledge-sharing work environment

Requirements

• Demonstrated background in sound scientific and engineering principles
• Excellent data analysis, bias for action, problem-solving, and communication skills
• Highly motivated and curious to research and learn new technical topics as needed

Qualifications

• PhD in mechanical engineering, electrical engineering, material science, physics or equivalent
• 2+ years work experience in process integration in a 200/300mm foundry environment (preferably in R&D)
• Hands-on experience with manufacturing execution systems; electron beam lithography; photolithography; wafer-level wet/dry etching techniques; wafer cleaning and lift-off techniques; thin film deposition and metrology techniques; electroplating; wafer thinning; chemical mechanical polishing; temporary and permanent wafer level bonding; wafer level and flip-chip packaging techniques; 2.5/3D integration schemes
• Familiarity with superconducting quantum computing components, fabrication, and packaging techniques
• Experience in performing failure analysis, root cause investigation for process excursions, yield monitoring, and statistical process control
• Proficient in at least one of the following: Python, Julia, MATLAB or other scripting languages
• Proficient in statistical data analysis, process optimization, and design of experiments using JMP or minitab

Skills

• Strong verbal, written, and data presentation skills

Benefits

• Work/Life Balance
• Mentorship & Career Growth

Pay

$142,800.00 - $193,200.00 USD annually

Schedule

Full-time