FAB Device Engineer Intern - Summer 2027

About the role

Primary responsibilities include functional yield enhancement (wafer probe), maintaining and improving parametric process control, developing integration changes to reduce cost or enhance device functionality.

Responsibilities

• Functional yield enhancement (wafer probe)
• Maintaining and improving parametric process control
• Developing integration changes to reduce cost or enhance device functionality

Qualifications

• Working toward an Electrical engineering degree is required or in another technical field with related experience (Chemical engineering, Materials science)
• Classroom and/or lab familiarity with some of the following: device parametric extraction methods, discrete device operation (MOS, BJT), microfabrication and unit process integration concepts, key statistical analysis and control concepts, materials analysis techniques, materials metrology operation and techniques
• Preferable would be previous educational, research, or industrial experience (co-op or internship) applying Solid State Physics, Electrical Engineering, Electronic Materials principles to microelectronics-related tasks
• Experience in JMP, PROMIS, SQL, LabView or bench probe characterization is a plus

Skills

• Ability to work independently
• Ability to work within a team-based project environment
• Keen interest in problem-solving using electrical testing, physical analyses, and statistical data analyses

In order to be considered for a summer internship with NXP you must be returning to school or graduating at the conclusion of the internship term. If you are graduating prior to July 2027 please apply to Entry Level full-time roles.