Engineering Technician / Micro-Electronic Wire Bonder Technician

Responsibilities

• Build and assemble units such as printed circuit assemblies (PCAs), modules, and subassemblies.
• Perform precision micro-electronics work including wire bonding under a microscope.
• Interpret schematics, wiring diagrams, bills of material (BOMs), and manufacturing instructions to determine required components and processes.
• Install and connect electronic components onto PCBs and substrates.
• Solder and de-solder through-hole and surface-mount components.
• Set up, operate, and maintain wire bonding equipment, ensuring proper bond integrity.
• Inspect wire bonds and micro-electronic assemblies using microscopes and measurement tools.
• Conduct rework, repair, and troubleshooting of assemblies.
• Support engineering activities including process improvements and documentation updates.
• Use hand tools, microscopes, jigs, and fixtures to assemble and secure components.
• Apply epoxy, encapsulate, cure, and clean processes.
• Conduct in-process inspections and visual checks to ensure quality standards are met.
• Maintain accurate production records and documentation.
• Follow all safety and ESD procedures.
• Maintain a clean and organized work environment.

Requirements

• High school diploma or equivalent required; technical training preferred.
• 0–3 years of experience in electronic assembly, micro-electronics, or wire bonding.
• Experience with microscope work and fine motor skills required.
• Basic understanding of electronic components and schematics.
• Ability to perform soldering and micro-assembly tasks to standard.
• Familiarity with ESD controls and IPC standards preferred.
• Strong attention to detail and ability to work with small components.
• Able to follow detailed instructions and procedures.
• Basic troubleshooting skills.
• Good manual dexterity and hand-eye coordination.
• Able to work effectively in a team environment.