Dry Etch Module Technical Staff- MTS/SMTS

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade.

About the role

As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry.

This role is for senior technical leaders in process engineering to join ID1, reporting directly to the Director of DE/WP/CMP. As a Member of Technical Staff (MTS) or Senior Member of Technical Staff (SMTS), you will play a pivotal role in driving innovation, leading technical projects, defining the technical roadmap, and mentoring fellow engineers. Your expertise will be instrumental in developing cutting-edge DRAM process solutions to support yield ramp-up.

Responsibilities

• Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures.
• Collaborate cross-functionally with integration, metrology, equipment, and R&D teams to ensure process robustness and manufacturability.
• Define and execute technical roadmaps aligned with DRAM scaling requirements and yield improvement goals.
• Evaluate and implement new etch technologies, chemistries, and hardware platforms.
• Mentor and guide developing engineers; foster a culture of innovation and technical excellence.
• Collaborate with equipment vendors and external partners to co-develop solutions.
• Drive root cause analysis and continuous improvement initiatives for process-related issues.
• Present findings and recommendations to executive leadership and global teams.

Requirements

• Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Minimum 10 years of hands-on experience in Dry Etch process development, preferably in DRAM or advanced memory technologies.
• Proven track record of technical leadership in semiconductor process engineering.
• Deep understanding of plasma etch mechanisms, process control, and defect mitigation.
• Experience with advanced etch tools (e.g., Lam, TEL, AMAT) and process characterization techniques.
• Strong analytical, problem-solving, and communication skills.
• Ability to lead cross-functional teams and manage complex projects.

Preferred Skills

• Experience with high aspect ratio etching, critical dimension control, and selectivity challenges in DRAM.
• Familiarity with data analytics, DOE methodologies, and SPC tools.
• Knowledge of integration challenges in sub-20nm DRAM nodes.
• Experience and/or interest in developing Agentic AI workflows into current or future processes.

Benefits

Micron benefits are designed to help you stay well, provide peace of mind, and help you prepare for the future. We offer:

• A choice of medical, dental, and vision plans enabling team members to select the plans that best meet their family healthcare needs and budget.
• Benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• A robust paid time-off program and paid holidays.

For additional information regarding the benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.