DMS Hardware Engineering Lead

About the role

We have an immediate opening for a highly motivated Principal Hardware Engineer to join the Diminishing Material Supply (DMS) Central Engineering Team (CET). In this role you will support the continued production and sustainment of complex microwave modules, sub‑modules, circuit card assemblies, and subsystems used across multiple projects, working closely with cutting‑edge hardware fielded on the most advanced military platforms.

Responsibilities

• Coordinate with hardware suppliers to resolve DMS issues.
• Perform electrical engineering evaluation of part obsolescence impact and identify potential replacements.
• Generate Change Orders (COs) to resolve production design issues.
• Partner with cross‑functional teams to mitigate DMS impacts to programs.
• Delegate tasks to less‑experienced engineers and technicians, monitor progress, review documentation for quality, and provide mentorship as required.
• Provide technical management of engineering activities related to replacement component assessment.

Requirements

• Bachelor’s Degree and 6+ years of applicable professional experience.
• Experience with RF/Microwave designs, circuit card assemblies, or other electronic systems.
• Ability to research and apply engineering principles to solve technical problems, including reverse‑engineering using circuit schematics and analyzing systems that use RF diodes, MOSFETs, ADCs, FPGAs, op‑amps, digital logic, signal‑integrity considerations, SMPS evaluation, SERDES, optical isolators/relays, and DDR or FLASH memory alternatives.
• Experience in logic, analog, RF design, FPGA power, and/or part selection.
• Excellent problem‑solving, judgment, and analytical capabilities.
• Active or previously held Secret Clearance (must be eligible to obtain a Secret Clearance at a minimum).

Preferred Qualifications

• Active Secret Clearance.
• Experience working in a manufacturing environment.
• Experience in RF/Microwave subsystem, module, and circuit design and development.
• Experience developing Engineering Basis of Estimate for proposed engineering work.
• Experience in packaging of electronics (e.g., BGAs, SOICs, DIE, etc.).
• Experience with Product Lifecycle Management (PLM) systems.

Pay

Full‑Time Salary Range: $118,095 – $200,762. Individual salaries are determined by business considerations, local market conditions, internal equity, and candidate qualifications such as skills, education, and experience.

Benefits

• Health, dental, and vision insurance.
• Health savings accounts.
• 401(k) savings plan.
• Disability coverage.
• Life and accident insurance.
• Employee assistance program.
• Legal plan.
• Discounts on home, auto, and pet insurance.
• Paid time off, paid holidays, paid parental, military, bereavement, and applicable federal and state sick leave.
• Company recognition program with monetary or non‑monetary awards.
• Additional incentives based on position level or job specifics.

About BAE Systems

BAE Systems, Inc. is a defense, aerospace, and security company headquartered in Falls Church, Virginia, with more than 40,000 employees worldwide. We develop and deliver advanced electronics, intelligence solutions, and dedicated customer support across air, land, maritime, space, and cyber domains. Our culture is performance‑driven and values‑led, built on curiosity, creativity, and collaboration. We protect those who protect us, and our mission drives breakthrough technologies that defend national security and make a lasting impact on our communities and the planet.