Director, NPI Operations

Responsibilities

• Lead the cross-functional NPI Core Team to ensure Design for Manufacturing (DFM) and Design for Test (DFT) requirements, specifically related to optical assembly and hybrid integration, are integrated early in the product design phase.
• Drive the Stage-Gate process from Proto to EVT (Engineering Validation), DVT (Design Validation), and PVT (Production Validation), with a focus on critical 3D CPO and laser manufacturing steps.
• Partner with Strategic Sourcing to identify and qualify specialized OSAT partners with expertise in Silicon Photonics packaging (e.g., fiber attach, lidding), wafer-level processing, and active/passive optical alignment.
• Manage high-tech component vendors (e.g., DFB lasers, specialized optical substrates) and high-level relationships with Tier 1 manufacturers to ensure capacity and capability align with the product roadmap.
• Own the "Ramp to Volume" strategy, identifying manufacturing bottlenecks in the pilot line, specifically related to laser burn-in and optical coupling, and implementing solutions to ensure a smooth transition to High-Volume Manufacturing (HVM).
• Monitor and report on First Pass Yield (FPY) focusing on end-of-line electro-optical performance metrics, and drive continuous improvement initiatives for wafer-level yield and module assembly yield.
• Develop and own the Master NPI Schedule, factoring in long-lead times for specialized foundry runs (e.g., Silicon Photonics wafers) and custom laser components.
• Proactively identify supply chain risks (e.g., single-source long-lead materials for CPO substrates or specialized laser drivers) and develop robust contingency plans, including alternate sourcing strategies for key optical components.
• Manage the Bill of Materials (BOM) cost targets through the development lifecycle, focusing on cost reduction.
• Ensure products meet aggressive margin targets required for global deployment at the point of launch.

Qualifications

• BS in Mechanical, Electrical, or Systems Engineering, or a relevant field.
• 10+ years of experience in Hardware Operations or NPI, specifically within the semiconductor, networking, or High-Performance Computing (HPC) industries.
• Deep understanding of semiconductor fabrication, advanced packaging (2.5D/3D), or optical assembly.
• Proven track record of managing cross-functional teams and external manufacturing partners in a high-growth, fast-paced environment.

Preferred Qualifications

• An MBA or MS in Supply Chain/Operations is a significant plus.
• Direct experience managing supply chains for silicon photonics, co-packaged optics (CPO), or highly complex advanced packaging (e.g., TSVs, interposers, wafer-on-wafer).
• Experience building supply chains for AI hardware accelerators, HPC clusters, or enterprise datacenter servers.
• Proven ability to thrive in a high-growth, ambiguous environment, toggling seamlessly between tactical execution and high-level executive strategy.
• Familiarity with the III-V materials ecosystem and external laser source procurement.

Benefits

• Comprehensive Health Care Plan (Medical, Dental & Vision)
• Retirement Savings Matching Program
• Life Insurance (Basic, Voluntary & AD&D)
• Generous Time Off (Vacation, Sick & Public Holidays)
• Paid Family Leave
• Short Term & Long Term Disability
• Training & Development
• Commuter Benefits
• Flexible, hybrid workplace model
• Equity grants (applicable to full-time employees)

Pay

$248,000 - $277,000 USD

Schedule

Not specified