Digital/Mixed Signal Design Electrical Engineer

Core Responsibilities

• Hardware Architecture: Design multi-layer mixed signal PCBs featuring high-pin-count FPGAs and ADC/DACs.
• High-Speed Design: Implement high-speed interfaces such as PCIe Gen 4/5, DDR memory interfaces, and 10/40/100G Ethernet.
• Ruggedization: Design for harsh environments (thermal cycles, mechanical shock, vibration, etc.).
• Power Integrity: Develop complex power trees capable of delivering high current at low voltages.
• Signal Integrity (SI) & Power Integrity (PI): Perform pre- and post-layout simulations to ensure timing closure and link reliability.
• Firmware: Collaborate closely with RTL teams to define pinouts, bank voltages, and clocking architectures that optimize PCB routing.

Qualifications

• A bachelor’s degree or higher in Electrical or Computer Engineering
• 10+ years experience designing complex mixed signal PCBs for harsh environments with high pincount components (FPGAs, SoCs, etc.)
• Experience with board bring-up and testing
• Experience with 1 or more PCB design tools (Altium is a preferred)
• Understanding of FPGA hardware requirements, including power distribution, high speed SERDES routing, memory interfaces, etc.
• Strong grasp of Design for Manufacturing (DFM) and Design for Test (DFT) in low-to-medium volume, high-complexity production
• Basic knowledge of RTL/firmware development

ITAR Requirements

To comply with U.S. Government export control regulations (ITAR), applicants must be one of the following:

• a U.S. citizen or national,
• a lawful permanent resident (green card holder),
• a refugee under 8 U.S.C. 1157, or
• an asylee under 8 U.S.C.1158.

Individuals who do not meet these criteria must be eligible to obtain the necessary authorizations from the U.S. Department of State. For more information, please refer to the ITAR guidelines. Learn about ITAR here.