Dielectric and Polymer Materials Engineer

About the role

Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses in high-performance computing. Our goal is to improve signaling characteristics and power consumption by integrating large glass substrates with active and passive elements.

Responsibilities

• Select, qualify, and support process window definition of advanced packaging dielectrics (ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
• Support determination of optimal processing conditions for these materials across various process teams
• Evaluate emerging dielectric materials and technologies (low-Dk/Df, glass core compatible systems) for roadmap fit
• Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
• Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
• Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms

Requirements

• Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
• Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
• Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
• Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
• Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
• Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms

Skills

• Fluent in English; proficiency in Korean is a plus
• Direct experience with glass core or glass interposer dielectric process integration
• Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
• Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
• Experience with CMP of dielectric films in damascene or hybrid bonding contexts
• Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
• Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
• Track record of material supplier engagement and collaborative efforts for material testing and qualification
• Publication record or patent activity in dielectric materials for packaging is a plus

Qualifications

• Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferred
• M.S. with 3+ years of relevant industry or research experience considered

Benefits

• 401K 6% matching (NO vesting period)
• Healthcare 100% support (Health, Dental, Vision)
• Life, STD, LTD 100% support
• Cell phone allowance
• PTO and self-development

PAY

$100,000 – $150,000