Die Attach - Operator, Assembly

Essential Responsibilities

• Wafer Fab Process Engineering
• Process Development for improved process yield, cycle time, and overall throughput.
• IIIV wafer fabrication for Photonics, especially InGaAs & Germanium strongly preferred.
• Front End Process: Photolithography, optical coatings, wet chemical processing, metallization, RIE & PECVD thin film deposition
• Backend Process: Grinding, Lapping, Polishing, Saw, Scribe
• Datacentric approach for design, process control, and improvements
• Able to forecast and implement upgrades for increased volume and new product production.
• Involves both capex and process innovation.
• Strong collaboration, relationship management, and interpersonal skills
• Possess Company values of honesty, integrity, respect, commitment and open to change while modeling the Company Core Principles in all activities
• Foster collaborative, cross department relationships to meet common objectives
• Problem solving ability with an organized & analytical approach
• Evaluate and optimize existing processes and procedures

Requirements

• Engineering or Physics degree (B.S or greater)
• Extensive semiconductor fabrication experience
• Photodetector and IIIV material experience desired
• Able to meet requirements to work with ITAR and US export restricted items
• Leverage Lean or Six Sigma experience beneficial

Experience

• Able to lift up to 75lbs
• Travel may be required

About GPD

GPD Optoelectronics Corp. is committed to operating with integrity and trust, driving constant organizational improvement, and strengthening relationships with employees and customers. Founded in 1973, we began by making high-quality germanium transistors and have since become a trusted manufacturer of both germanium and indium gallium arsenide photodiodes. We are located in Salem, NH.