DFM and Process Engineer

About the role

At Celestica, we don’t just manufacture high‑complexity technology—we design, engineer, and optimize the hardware powering the future. As a global leader in design, engineering, and manufacturing services, our teams partner with world‑changing brands across cloud infrastructure, aerospace, defense, healthtech, and advanced electronics. Located in Richardson, TX, our site offers a collaborative, fast‑paced environment where your technical voice directly impacts the physical products shaping tomorrow’s technology landscape.

Responsibilities

• Run pre‑DFM analysis on assigned packages using automated toolsets (e.g., Valor) and issue formal reports before release within agreed turnaround times.
• Log every DFM finding in the central register, specifying severity level, routing paths, and the technical evidence supporting the rule.
• Partner directly with layout engineers to resolve findings—driving design changes where appropriate or negotiating process/supplier mitigations when layout adjustments are not feasible.
• Verify closure of dispositioned issues on subsequent build revisions and document closure evidence.
• Serve as the subject matter expert supporting site‑level DFM, PCB fabrication, and SMT process questions for assigned programs.
• Propose rule changes when findings recur across platforms, and actively maintain/update Valor check encodings for all rules within scope.
• Own key deliverables—including pre‑DFM reports, register finding entries with closure evidence, Valor rule encodings, and rule change proposals. Performance is measured on pre‑DFM coverage, review turnaround times, the percentage of findings successfully closed, and the elimination of repeat findings.

Skills

• Deep technical expertise in Design for Manufacturability (DFM), PCB fabrication, and SMT assembly processes for high‑density, complex electronic assemblies.
• High proficiency with DFM automated analysis tools (specifically Siemens Valor NPI/Valor MSS) including rule encoding and setup.
• Solid familiarity with IPC standards (e.g., IPC‑A‑610, IPC‑2221/2222, IPC‑7351) regarding PCB design, land patterns, component clearances, and solderability.
• Hands‑on understanding of SMT manufacturing parameters, stencil design, reflow profiling, and PCB fabrication tolerances.
• Strong cross‑functional communication and direct collaborative skills to partner with hardware layout engineers, Manufacturing Test Leads (MTLs), and site SMT process teams.

Qualifications

• 4 to 8 years of experience in DFM, PCB fabrication engineering, or SMT process engineering within high‑complexity electronics manufacturing.
• Bachelor’s degree in Electrical Engineering, Materials Engineering, Manufacturing Engineering, or a related technical discipline (educational requirements may vary by geography).

Requirements

• Physical demands: duties performed in a normal office