Device & Process Integration Engineer

Role: Process Integration Engineer in the DRAM R&D Memory Group, focusing on developing core memory technology for AI-enabled applications. Responsibilities Own process integration for front-end modules, defining schemes, managing unit processes, and meeting technology milestones.Design and execute Design of Experiments (DOEs), analyze silicon data, and troubleshoot root causes.Utilize device and process modeling (e.g., TCAD, Sentaurus) to evaluate interactions, device behavior, and scaling options, correlating simulations with experimental data to improve accuracy.Collaborate across teams including Process Development, Device Engineering, Yield, and Manufacturing to resolve technical issues.Summarize complex problems, develop recommendations, and facilitate consensus for solutions.Support technology transfer from R&D to manufacturing, ensuring successful implementation. Qualifications Master’s or PhD in Electrical Engineering, Physics, Materials Science, or related field, with semiconductor industry experience.Experience in semiconductor process integration, development, and silicon-based troubleshooting.Knowledge of device physics and hands-on experience with process/device modeling tools.Proficiency in data analysis, DOE, and statistical techniques. Preferred Skills: Experience with memory, logic, or advanced-node integration, model calibration, and technology transfer; strong communication and teamwork skills; self-motivated with technical problem-solving passion.