Design Engineer 2 (Job ID#9539135 )

Duties

• Module level design, modeling, and integration of PAs, LNAs, switches and filters into highly compact Multi-chip Modules (MCM).
• Specifically involves working with microwave/RF Front-End circuit design like PA or LNA design details (DC bias, Bias Tee, Stability, impedance matching etc.) and RF testing.
• Experience integrating module dies such as amplifiers, switches, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive RF front-end modules (FEMs).
• Use of RF CAD tools (ADS and/or Cadence Simulation and Layout) and EM simulators such as ADS Momentum, ADS FEM, and/or Ansys HFSS in conjunction with circuit simulators to accurately predict overall circuit performance.
• Responsibility for Electromagnetic (EM) Simulation tools ADS FEM/Ansys HFSS to develop laminate-based modules.
• Supporting Full Module Simulation.
• Work in close communication and cooperation with design, modeling, and process engineering teams to generate, implement and support best-in-industry Nonlinear and Linear models.
• Characterization, verification, and debugging of the design through lab measurements with data analysis and programming tools such as Spotfire and Excel.
• Designing III-V microwave/millimeter-wave MMIC amplifiers, switches, phase shifters, attenuators, time-delay units (TDUs), hybrid multichip modules, or transmit/receive front-end modules (FEMs).
• Support product through critical lifecycle stages including concept/feasibility, development, qualification, and production.

Minimum Requirements

• Bachelor's degree in Electrical Engineering with coursework Radio Frequency focus, and 3 years of work experience.
• 1 year of experience involving knowledge or understanding of:
  • Microwave/RF Front-End circuit design like PA or LNA design details (DC bias, Bias Tee, Stability, impedance matching etc.) and RF testing.
  • Integrating module dies such as amplifiers, switches, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive RF front-end modules (FEMs).
  • Using RF CAD tools (ADS and/or Cadence Simulation and Layout) and EM simulators such as ADS Momentum, ADS FEM, and/or Ansys HFSS in conjunction with circuit simulators to accurately predict overall circuit performance.
  • Responsibility for Electromagnetic (EM) Simulation tools ADS FEM/Ansys HFSS to develop laminate-based modules.
  • Supporting Full Module Simulation.

Alternative Requirements

• In lieu of a Bachelor's degree, a Master's degree in Electrical Engineering with coursework Radio Frequency focus and 1 year of work experience or 9 graduate credit hours involving knowledge or understanding of:
  • Microwave/RF Front-End circuit design like PA or LNA design details (DC bias, Bias Tee, Stability, impedance matching etc.) and RF testing.
  • Integrating module dies such as amplifiers, switches, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive RF front-end modules (FEMs).
  • Using RF CAD tools (ADS and/or Cadence Simulation and Layout) and EM simulators such as ADS Momentum, ADS FEM, and/or Ansys HFSS in conjunction with circuit simulators to accurately predict overall circuit performance.
  • Responsibility for Electromagnetic (EM) Simulation tools ADS FEM/Ansys HFSS to develop laminate-based modules.
  • Supporting Full Module Simulation.

Qualifications

Send Resume to: Job.Applicant@qorvo.com

include Job Ref# **9539135** in the subject line.

EEO.