CLAWS Packaging Engineer

About the role

The CLAWS Packaging Engineer will lead packaging of wide bandgap semiconductor devices, including RF devices, high power electronic devices, and visible spectrum optoelectronic devices. Responsibilities include defining interconnect strategies, performing thermal and mechanical analysis, and ensuring compatibility with wafer-level processes and test infrastructure.

Responsibilities

• Lead packaging of wide bandgap semiconductor devices (30%)
  • RF devices including HEMTs and MMICs
  • High power electronic devices including HEMTs, FETs, and diodes
  • Visible spectrum optoelectronic devices and Photonic Integrated Circuits.
• Packaging Design and Assembly Workflows (25%)
  • Specify package solutions that meet the performance requirements of new technology platforms in collaboration with CLAWS teams.
  • Define scalable workflows to realize packaged discrete devices, integrated circuits, or modules.
  • Participate in cross-functional design initiatives that improve performance, manufacturability, yield, or reliability.
• Process Integration (25%)
  • Lead the development and integration of processes in, for example, die attach, wire bonding, and encapsulation.
  • Analyze package and module performance. Inform electrical, thermal, and mechanical simulations with design and characterization data.
  • Troubleshoot process integration challenges related to defectivity, yield, and reliability.
• Cross-functional Collaboration (20%)
  • Collaborate with circuit designers, applications engineers, and product development teams to realize integrated system-level advantages.
  • Stay up to date with emerging technology trends, competitive landscape, and industry benchmarks.

Qualifications

• Minimum Education and Experience:
  • Ph.D. or relevant terminal degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; or
  • Master’s degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 5 years of experience in high power, RF, or photonics device packaging and process integration (industry or research).
  • Bachelor’s degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 8 years of experience in high power, RF, or photonics device packaging and process integration (industry or research).
• Other Required Qualifications:
  • Experience designing and implementing packaging processes for high power, RF, or photonics applications.
  • Excellent communication and interpersonal skills.
  • Ability to multitask and meet deadlines with moderate supervision.
  • Ability to follow safe procedures for working with semiconductor packaging or fabrication equipment, chemicals, and compressed gas cylinders.
  • Comfort in collaborating with students, faculty, and staff of varying experience and backgrounds.
  • Eligibility to obtain clearance upon request of the US government.
• Preferred Qualifications:
  • Modeling thermal, electrical, or mechanical behavior(s) in packaged devices.
  • Characterization of devices and processes, including failure analysis and defect inspection.
  • RF or optical signal integrity.
  • Advanced packaging architectures.
  • Design for reliability and reliability testing.
  • MES and SPC systems.
  • Statistical methods (e.g., DOE, GR&R) and tools (e.g., JMP, Minitab).
  • Material specification and vendor management.

Benefits

North Carolina State University offers a comprehensive range of benefits including medical, dental, and vision insurance, flexible spending accounts, retirement programs, disability plans, life insurance, accident plan, paid time off and other leave programs, 12 holidays each year, and more. For more information, please refer to the Wolfpack Perks and Benefits section.