Chemical Mechanical Planarization (CMP) Process Engineer

Crosslinked Jobs/Chemical Mechanical Planarization (CMP) Process Engineer One of 4,539 polymer and materials roles on Crosslinked, each read for materials, degree, visa and salary. See roles like this BR H-1B history This employer has filed H-1B petitions with the U.S. Department of Labor in the past. That is a record of prior filings, not a statement about this role. Whether any given position is eligible for sponsorship is decided by the employer, case by case. Confirm before you apply. Chemical Mechanical Planarization (CMP) Process Engineer Broadcom Fort Collins, COtodayverified 2 h ago $91k – $146k BS-level Process Engineering roles on Crosslinked list a median of $112k (567 that show pay). Develop and sustain CMP processes in a wafer fab to improve yield and device performance. Apply Process Engineering roles, by email Apply Worth knowing Why it is interesting. Hands-on CMP process ownership in a high-volume RF semiconductor fab with direct yield and NPI impact. Might not be for you. Requires 5+ years semiconductor manufacturing experience; CMP-specific background preferred. Deep specialist BS acceptableSenior hires only Adjacent materials roledeveloping, optimizing, and ensuring the quality of CMP processes within the wafer fabrication facility Seniority Mid-level Work On-site Type Full-time Degree BS Experience 5+ yrs Industry Semiconductor Role Process Engineering Techniques SPC229 rolesDesign of Experiment (DOE)4 rolesFDC1 role Benefits new hire equity grantannual equity awardsESPP Role details Job Description The Wireless Semiconductor Division (WSD) designs and develops highly integrated, state-of-the-art RF front-end solutions for use in mobile communications and WiFi access points. Together, we’re enabling our customers to distinguish their products using Broadcom’s differentiated RF semiconductors. As a CMP Process Engineer in the Finish Team, you will be responsible for developing, optimizing, and ensuring the quality of CMP processes within the wafer fabrication facility located in Fort Collins, Colorado. You will work closely with Equipment Engineers, Industrial Engineering, R&D, and external Vendors to meet the needs of high volume manufacturing and technology development with process capability. Roles & Responsibilities Sustain daily CMP operations by monitoring statistical process control (SPC) charts and responding to lot holds, tool issues, and fault detection & classification (FDC) interdiction events.Investigate and correct manufacturing defects, scrap, and other issues using root-cause analysis within a Plan-Do-Check-Act (PDCA) system.Develop, characterize, and optimize processes to enable new product introduction (NPI), support new technology from R&D teams, increase wafer yield, and improve device performance.Work closely with and communicate changes to stakeholders at various levels of the organization, including Operators and Process Technicians.Qualify new tools and recipes through the design and execution of rigorous process qualification plans while evaluating the impact on cost, throughput, capacity, and other factors.Collaborate with integration, yield, procurement, and other teams to implement continuous improvement projects within the area of ownership.Document procedures for Operators and other tool users to enable their operation of the equipment for the desired outcomes. Qualifications B.S. in Chemical Engineering, Mechanical Engineering, or related field.5 years of experience working in semiconductor manufacturing, CMP experience preferred.Experience maintaining an established process, monitoring inline data, and responding proactively to issues affecting Yield and/or Quality.Excellent teamwork and good verbal and written communication skills. Demonstrated strong partnership skills with teams like Operations and Process Technician organizations.Good problem solving skills, sound analytical techniques, and an ability to solve problems systematically. Design of Experiment (DOE), characterization, and optimization capabilities. Strong understanding of SPC and proficiency with data science and SPC software (JMP, Spotfire, SPACE, Excel, etc).Familiarity applying Lean manufacturing, Six-Sigma, and similar principles to complex issues.Demonstrates good judgment in selecting methods and techniques for obtaining solutions.Strong sense of ownership and willingness to work across organizational boundaries to resolve issues. Compensation And Benefits The annual base salary range for this position is USD 91,100.00 To USD 146,000.00 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. R027188 Connected All roles at BroadcomMore Process Engineering rolesRoles using SPC Related roles MP Process Improvement EngineerMOS Plastics Inc. (Currier) San Jose, CA MR Senior Process EngineerManagement Recruiters of Tallahassee Providence, RI QA Engineer-ManufacturingQarbon Aerospace Milledgeville, GA BA Project EngineerBrightpath Associates LLC Akron, OH SA Mold Qualification EngineerSystems Ally Minneapolis, MN Common questions What is the salary for the Chemical Mechanical Planarization (CMP) Process Engineer role at Broadcom? The listed annual base salary range is $91K–$146K. This figure is taken from the posting itself. Does Broadcom sponsor H-1B visas? Broadcom has filed H-1B petitions with the US Department of Labor in past years, but this specific posting does not explicitly mention sponsorship for the Chemical Mechanical Planarization (CMP) Process Engineer role. Confirm with the employer before applying if visa support is required. Where is the Chemical Mechanical Planarization (CMP) Process Engineer role at Broadcom based? This role is based in Fort Collins, CO. What degree is required for the Chemical Mechanical Planarization (CMP) Process Engineer role at Broadcom? This role requires a BS. How many years of experience does this Chemical Mechanical Planarization (CMP) Process Engineer role require? The posting calls for at least 5 years of relevant experience. What techniques or methods are required for this Chemical Mechanical Planarization (CMP) Process Engineer role? SPC, Design of Experiment (DOE), FDC.