Camera Engineer

About the role

Camera Engineer – Fulltime position based in Sunnyvale, CA.

Responsibilities

• Develop Camera Module assembly process / equipment / materials for FOL (Front of Line) and EOL (End of Line)
• Develop new assembly process / equipment / material for Camera module related components
• Provide technical leadership in resolving any process issues
• Responsible for developing DOEs, Statistical Process Analysis, Process Specification, D/PFMEA and Process control plan
• Responsible for Failure analysis, Corrective actions and Yield improvement
• Process technology feasibility studies through theoretical simulation and/or practical engineering methods
• Process Development – Leads design and development of technically complex manufacturing processes including material selection, parameter optimization, equipment, metrology, and system design to enable new products designs & functional requirements
• Develop Process for Manufacturability – Provide early and ongoing manufacturing leadership to ensure new process is scalable for high volume
• Process FMEA – Lead PFMEA generation for new process technology
• Failure Analysis – Lead root cause analysis and metrology development for issues related to new process technology
• Supporting complex, high volume camera module modules. Provide leadership in the areas of module construction, materials, equipment, and processes
• Identify the correct product process flow, compatible with high volume manufacturing requirements
• Work to develop key and new process/equipment/material for camera module
• Participate in external vendor assessment and selection, from MP intent equipment, process, to direct and indirect materials
• Responsible for DOE planning, statistical process analysis, process specification, and D/PFMEA

Requirements

• Over 7 years of hands-on experience in semiconductor IC or module packaging, especially on Camera Module or related processes
• Process technology knowledge in SMT and advanced IC / camera module packaging areas
• Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire Bonding, Molding, Wafer Dicing, Laser Singulation, Lens Holder / Active Alignment Process
• Experienced working with subcontract manufacturing partners
• High volume manufacturing and production ramp experience
• Knowledgeable in production control processes, machine commissioning, data analysis/interpretation GR&R, Cp/Cpk and correlation analysis
• Fluent in English communication; additional language skills a plus
• Demonstrated ability to perform DOE, data analysis, SPC control
• Demonstrated failure mode analysis, root cause investigation, and problem solving for product yield and quality issue
• Project Management – Excellent data handling, documentation, critical milestone creation, and organization skill
• Strong collaboration skill to work with diversified cross‑functional team