AVP Semiconductor Expert

About Lumenci

Lumenci is a cutting-edge legal tech startup founded by IIT alumni to revolutionize the legal and intellectual property (IP) industry in the U.S. and Europe. We collaborate with top technology firms, law practices, and startups to help them protect, manage, and monetize their intellectual property assets.

Responsibilities and Duties

• Identify and seize new business opportunities in the semiconductor IP space, driving revenue and high-value client engagements.
• Develop and execute winning go-to-market strategies for Lumenci’s products and services.
• Build and nurture relationships with executives, IP litigators, law firms, corporate clients, and investors, positioning Lumenci as an industry leader.
• Lead high-impact negotiations for patent licensing, acquisitions, and litigation support services.
• Represent Lumenci at global conferences, industry panels, and executive roundtables to strengthen our brand and influence.

Semiconductor Industry Experience

• Leverage deep knowledge of semiconductor design, fabrication processes, packaging technologies, and advanced node technologies (FinFET, GAAFET, 3D ICs, etc.).
• Stay ahead of the curve on emerging semiconductor innovations such as AI-driven chip design, RISC-V, heterogeneous computing, chiplets, photonic ICs, and advanced lithography (EUV, DUV).
• Analyze semiconductor patent portfolios to uncover monetization opportunities, licensing potential, and infringement risks.
• Mentor and lead a team of semiconductor and IP experts, fostering a culture of innovation and technical excellence.

Business Growth & Strategic Leadership

• Proven track record of driving revenue growth, client acquisition, and business development in semiconductors, IP, or legal technology.
• Strong ability to engage and influence C-suite executives, legal teams, and investors to drive strategic partnerships and business expansion.
• Experience structuring and closing high-value deals, including IP licensing agreements, technology transactions, and litigation support engagements.
• Deep understanding of semiconductor IP monetization, litigation, and licensing strategies to help clients maximize the value of their intellectual property.
• Strong client relationship management skills, with expertise in handling complex, multi-stakeholder engagements in the semiconductor and legal sectors.

Technical Expertise Required

• Expert-level knowledge of semiconductor process technology, design methodologies, and IP-driven business models.
• Strong grasp of standard essential patents (SEPs), patent pools, and semiconductor IP litigation trends.
• Hands-on experience in technical due diligence, IP valuation, and patent monetization.
• Consulting & Management - Strong client management and stakeholder engagement skills.
• Ability to simplify highly technical semiconductor concepts for non-technical audiences.
• Proven experience advising executives, IP litigators, and corporate clients on semiconductor technology strategy.
• Excellent technical writing and verbal communication skills for reports, whitepapers, and legal documentation.

Strategic Leadership

• A proven track record of driving revenue, client acquisition, and business development in semiconductor, IP, or legal technology.
• The ability to engage and influence C-suite executives, legal teams, and investors.
• Experience structuring and closing high-value deals, including IP licensing, technology transactions, and litigation support.

Education & Experience Requirements

• B.Tech/M.Tech/Ph.D. in Electrical Engineering, Telecommunications, Computer Science, or a related field.
• 15+ years of experience in semiconductor, IP strategy, patent monetization, or a related field.
• Extensive experience in business development, revenue generation, and executive-level consulting.
• Prior experience with IP litigation, patent licensing, or semiconductor regulatory strategy is a big plus.

Skills

• microprocessors, analysis, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process, product testing, business development, product teardowns, design methodologies, audits, collaboration, relationship management, professional growth, edge computing, client management, power devices, semiconductor, semiconductor IP, system-on-chip (SOC) integration, research reports, complex technical communication, circuit extraction, verbal communication, blogging, private 5G, mentor graphics, synopsys, processor architectures, reverse engineering, travel management, digital forensics, source code review, technology due diligence, ASIC/FPGA design, patent portfolio analysis, technical writing, semiconductor device, infringement analysis, telecom network architectures, c-suite engagement, semiconductor industry, revenue generation, patent licensing, stakeholder engagement, technical research, sc-FDMA, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless communication standards, adaptability, teamwork, memory devices, client meetings, chip packaging, market research, semiconductors, spectroscopy analysis, semiconductor process technology, semiconductor packaging, problem-solving, material characterizations, data analysis, advanced packaging, image sensors, microcontrollers, wireless