ATD Laser Development Engineer

About the role

Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation.

Key Responsibilities

• Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies.

• Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements.

• Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles.

• Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows.

• Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.

• Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues.

• Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development.

• Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones.

Qualifications

• Minimum Qualifications: Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field OR Master's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field

• Relevant Experience: Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles. Fundamental understanding of laser and optical systems.

Preferred Qualifications

• Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems.

• Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly.

• Demonstrated ability to collaborate with cross-functional teams and deliver results in time-sensitive projects.

• Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.