Associate, Electrical Engineering- Digital Signal Processing

L3Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers’ mission and quest for professional growth. We provide an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do.

About the role

As an Associate Electrical Engineer specializing in Digital Signal Processing, you will determine design approaches and parameters, perform system analysis to assess feasibility within time and cost constraints, and utilize modeling tools to establish operating data and evaluate results. You will design, analyze, modify, test, and evaluate FPGA and programmable hardware, as well as complex Circuit Card Assemblies for Avionics and Space customer photonic subsystems and integrated communication systems.

Responsibilities

• Perform system analysis to determine design feasibility within time and cost constraints
• Utilize modeling tools and equipment to establish operating data, conduct experimental tests, and evaluate results
• Select components and equipment based on analysis of specifications and reliability
• Perform simulations and present design reviews to peer engineers
• Write scripts to control synthesis and build tools
• Design, analyze, modify, test, and evaluate FPGA and programmable hardware
• Design complex Circuit Card Assemblies to support Avionics and Space customer’s photonic subsystems and integrated communication systems
• Develop digital designs requiring programmable logic, VHDL language, and digital communications systems knowledge
• Design modems (including SATCOM, wireless, cellular, and software-defined radios) with knowledge of digital communications systems, waveform generation, signal processing, and FPGA design (VHDL)
• Develop DSP designs requiring knowledge of digital signal processing techniques, algorithm development, software coding, and simulation/modeling using MATLAB
• Work on microelectronics design with training in advanced electronics packaging and MEMS technology (experience with high-density interconnect and semiconductor packaging technology is desired)

Requirements

• Pursuing or recently completed (within the last 12 months) a Bachelor’s Degree in Electrical Engineering, Computer Engineering, Electrical & Computer Engineering, Materials Engineering, Materials Science Engineering, or a related field

Skills

• Digital communications systems
• VHDL language and FPGA design
• Digital signal processing techniques and algorithm development
• MATLAB for simulation and modeling
• Scripting for synthesis and build tool control
• Advanced electronics packaging and MEMS technology (desired)
• High-density interconnect and semiconductor packaging technology (desired)

Pay

The salary range for this role in California, Massachusetts, New Jersey, Washington, and the Greater D.C, Denver, or NYC areas is $71,000.00 - $132,000.00. Final offer amount may vary based on experience and geographic location.

Benefits

• Health and disability insurance
• 401(k) match
• Flexible spending accounts
• Employee Assistance Program (EAP)
• Education assistance
• Parental leave
• Paid time off
• Company-paid holidays

The specific programs and options available may vary depending on date of hire, schedule type, and applicability of collective bargaining agreements.