Associate Characterization and Test Engineer

Job Summary

The Characterization & Test Engineer will support the evaluation, characterization, and validation of photonic devices, packages, and subsystems. This role will be responsible for executing electrical, optical, thermal, and mechanical tests, analyzing data, and supporting failure analysis and reliability investigations.

Responsibilities

• Execute electrical, optical, thermal, and mechanical characterization of photonic devices, packages, and assemblies.
• Develop and perform test plans to support product development, process validation, reliability testing, and failure analysis activities.
• Operate and maintain laboratory equipment, including optical measurement systems, vibrometers, thermal imaging systems, and mechanical testers.
• Collect, analyze, and interpret test data to identify performance trends and engineering insights.
• Support Design of Experiments (DOE) planning, execution, and data analysis.
• Affiliate in root-cause investigations by performing characterization and supporting failure analysis activities.
• Develop automated test scripts and data analysis tools using Python or similar programming languages.
• Generate clear technical reports and communicate results to cross-functional teams.
• Contribute to the development of new characterization methods, test fixtures, and laboratory capabilities.
• Support qualification and reliability testing activities, including thermal, mechanical, and environmental stress testing.
• Maintain laboratory documentation, procedures, and equipment calibration records.
• Collaborate with product, packaging, reliability, process, and manufacturing engineers to solve technical challenges.

Experience/Qualifications

• Bachelor's or master’s degree in Mechanical engineering, Optical Engineering, Applied Physics, or a related discipline.
• 0–3 years of experience in engineering characterization, testing, laboratory operations, or product development.
• Hands-on experience operating characterization equipment including Infrared Thermography, Laser Doppler Vibrometers (LDV), Instron Universal Mechanical Testers, and C-Mode Scanning Acoustic Microscopy (C-SAM).
• Experience analyzing thermal, mechanical, vibration, and package integrity data to support product development, reliability, and failure analysis activities.
• Experience with laboratory instrumentation and data acquisition systems.
• Basic understanding of optics, photonics, electronics, semiconductor devices, or advanced packaging technologies.
• Familiarity with data analysis tools such as Python, MATLAB, JMP, or equivalent.
• Knowledge of Design of Experiments (DOE) and statistical analysis methods.
• Strong analytical and problem-solving skills.
• Excellent written and verbal communication skills.
• Self-motivated and able to work effectively in a fast-paced R&D environment.

Preferred Qualifications

• Experience with photonic devices, optoelectronics, semiconductor packaging, or advanced manufacturing.
• Familiarity with optical alignment, imaging systems, or optical characterization techniques.
• Experience with automation, scripting, and test development.
• Exposure to reliability testing or failure analysis methodologies.